Agilent: New SOC Tester Starts at $1,500 per Pin
Agilent: New SOC Tester Starts at $1,500 per Pin
Palo Alto, CA - September 27, 2000--Agilent Technologies, Inc. introduced a new model into its 93000 SOC Series Test System family, featuring full compatibility with the existing SOC test series at the price of $1,500 per pin.
"We are offering yet another scalable model to reduce cost of test in response to those companies that are concerned about the economies of test," said John Scruggs, senior vice-president and general manager of Agilent's Automated Test Group. "At $1,500 per pin, the C200e carries a radically low price point and boasts the lowest capital cost of any platform SOC test system on the market, yet can still expand to meet a manufacturer's evolving needs."
Along with the C200e, Agilent will release the new C400e. Like the C200e, the C400e is compatible with existing models, offers increased capabilities and excels at testing high-complexity and high-speed devices including PC graphics, high-end DSPs, high-speed chipsets and ASICs. Additionally, the C200e and C400e are well suited for both structural test techniques, such as scan and built-in self-test, and functional testing, the company said.
For more information contact:
Agilent Technologies Inc.
Palo Alto, CA
www.agilent.com
Related Semiconductor IP
- UMC 55nm ULP 3.3V Temperature Sensor
- High-Throughput Multi-Channel DMA Controller
- Configurable Multi-Channel DMA Controller
- Fixed-Channel Multi-Channel DMA Controller
- Verification IP for MIPI SoundWire
Related News
- Agilent Technologies' breakthrough SerDes IP semiconductor core enables integration of 150 channels per chip
- Jennic purchases state-of-the-art Agilent RF IC tester for on-site product validation and test development
- Shipments of total OpenGL ES enabled GPUs to hit 1 billion units per year by 2014, says Imagination
- ARM, Softbank and 1,500 Engineers
Latest News
- Alliance for Open Media Sees Rapid AV2 Adoption Across the Video Ecosystem Just Four Months After Release
- Rambus and ChipAgents Collaborate to Accelerate Chip Design with Agentic AI
- Server CPU Shipments Projected to Grow Over 40% YoY in 2027, with Arm-Based Products Continuing to Gain Market Share
- UMC and AP Memory Collaborate to Enable Advanced Power Delivery Solutions for AI and HPC Systems
- Cadence AI Super Agents Enable Nokia to Accelerate Electronic System Design on Millennium M2000 Supercomputer