A matter of the design chain
| EE Times: A matter of the design chain | |
| Mark Templeton (04/18/2005 9:00 AM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=160901315 | |
| Four critical technologies must come together for the success of a chip design: commercial intellectual property; electronic design automation tools and flows; foundry process information; and the design team's own custom design and chip assembly technique. Let's look at each in turn.
Most commercial IP is high-integrity and low-risk. It has usually been proven in silicon on tens, hundreds or possibly thousands of designs across a large number of processes. A similar argument can be made for commercial design tools. The user community for leading EDA tools is huge. By and large, EDA tool quality is outstanding. Occasionally, a design may fail because a simulation or verification step was not performed thoroughly, but rarely is a tool to blame.
The third critical piece of the puzzle is the foundry's own process models, DRC flows, etc. Even the smallest issue with this level of process abstraction can lead to poor results. Most foundries have become expert at establishing and exhaustively testing these models. Still, it is common for a new process to undergo a transition once volume experience is gained from early customer designs.
The circuitry newly created by the designers will rely totally on the accuracy of the process information, the analysis of the design tools and the skill of the design team. This is where the opportunity is and where the strong design chain partnerships that exist among the foundry, EDA vendors, IP vendors, flow developers and, of course, the actual chip design team come into play.
By Mark Templeton, president and chief executive officer of Artisan Components Inc.
| |
| - - | |
Related Semiconductor IP
- Generative AI Edge Processor
- AXI NoC Non-Coherent Mesh
- CXS c/d/Lite Verification IP
- USB OTG 2.0 with xHCI Verification IP
- DDR5 RDIMM Verification IP
Related News
- ChipAgents Raises Oversubscribed $21M Series A to Redefine AI for Chip Design
- Are Synopsys Layoffs a Harbinger of the AI-Assisted Design Era?
- DI3CM-HCI, A High-Performance MIPI I3C Host Controller IP Core for Next-Generation Embedded Designs
- Cadence Unleashes ChipStack AI Super Agent, Pioneering a New Frontier in Chip Design and Verification
Latest News
- ChipAgents Collaborates With NVIDIA to Launch Build-A-Chip-Bench for Autonomous Chip Design and Implementation
- Quintauris and Microchip Technology join forces to grow RISC-V® adoption
- BrainChip Launches Sequora: Edge AI That Doesn’t Just Recognize — It Understands and Responds
- GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative
- Siemens’ Tessent ecosystem enables direct test pattern execution via PCIe and USB