Samsung and Synopsys Collaborate to Achieve First 14-nanometer FinFET Tapeout 2012-12-21 12:07:00 EDA & Design Tools
ARM and Cadence Tape Out First 14nm FinFET Test Chip Targeting Samsung Process 2012-12-21 12:05:00 IP Cores & Design
IDT and PLX Technology Announce Termination of Proposed Transaction and IDT Withdraws Exchange Offer for PLX Technology Shares 2012-12-20 15:29:00 Strategic Partnerships
SMIC Achieves Breakthrough in Backside-Illuminated Image Sensors 2012-12-20 14:45:00 Foundries & Process Nodes
Xilinx Vivado Design Suite Now Available in WebPACK Edition 2012-12-20 09:40:00 SoC Architecture & Assembly
MediaTek Strengthens Global Position with World's First Quad-Core Cortex-A7 System on a Chip - MT6589 2012-12-20 02:17:00 SoC Architecture & Assembly
Vivante Shipping World's Smallest and Lowest Power OpenGL ES 3.0 IP Core 2012-12-19 14:38:00 IP Cores & Design
Gartner Says Worldwide Wafer Fab Equipment Spending to Decline 9.7 Percent in 2013 2012-12-19 07:54:00 Analysis & Insight
Mentor Graphics Nucleus Innovate Program Adds Boards from STMicroelectronics to Accelerate Start-Up Development 2012-12-19 07:46:00 SoC Architecture & Assembly
Altior's AltraSTAR - Hadoop Storage Accelerator and Optimizer Now Certified on CDH4 2012-12-19 07:44:00 SoC Architecture & Assembly
Linley Group Report estimates embedded processor market will exceed $4 billion in 2015 2012-12-19 01:33:00 Analysis & Insight
Trustonic: The New Standard of Trust and Security for Connected Devices 2012-12-18 14:00:00 Strategic Partnerships
HDL Design House MIPI M-PHY and D-PHY Solutions available in 40nm and 65nm 2012-12-18 11:57:00 IP Cores & Design
UMC Achieves Foundry's First 55nm SDDI Customer Product Tape-out 2012-12-18 11:08:00 Foundries & Process Nodes