Ceva Unveils Ceva-Waves Links200 - A Breakthrough Multi-Protocol Wireless Connectivity Platform IP Featuring Next generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4 2025-01-02 13:43:00 IP Cores & Design
SoftBank’s Izanagi AI processor could arrive in 2025, says report 2025-01-02 11:00:00 Analysis & Insight
Nano Labs Launches FPU3.0 ASIC Design Architecture with 3D DRAM Stacking for AI and Blockchain Innovation 2024-12-26 18:32:00 SoC Architecture & Assembly
QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program 2024-12-24 09:53:00 Commercial Deals
GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services 2024-12-23 19:05:00 Strategic Partnerships
RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models 2024-12-20 16:06:00 SoC Architecture & Assembly
Enhancements to Creonic's DVB-S2X IP Cores for Greater Flexibility and Performance 2024-12-20 13:36:00 IP Cores & Design
Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity 2024-12-20 09:13:00 IP Cores & Design
Etched Selects Agnisys’ IDesignSpec™ to Streamline AI Chip Development 2024-12-19 13:26:00 EDA & Design Tools
VeriSilicon unveils next-generation high-performance Vitality architecture GPU IP series 2024-12-19 08:06:00 IP Cores & Design
Lattice Advances Low Power FPGA Leadership with New Small and Mid-range FPGA Offerings 2024-12-19 02:51:00 SoC Architecture & Assembly
Crypto Quantique adds TRNG to its quantum-derived, side-channel protected PUF hardware IP block 2024-12-18 20:12:00 IP Cores & Design
Arm, Qualcomm Case Goes to Court Over Arm Architecture Licenses 2024-12-18 15:27:00 Analysis & Insight
Andes Technology Partners with ProvenRun to Strengthen RISC-V Trusted Execution Environment 2024-12-18 10:51:00 SoC Architecture & Assembly
Synopsys and SiMa.ai Announce Strategic Collaboration to Accelerate Development of Automotive Edge AI Solutions 2024-12-18 10:27:00 EDA & Design Tools