D&R announces a new version of its IP and EDA Tools Enterprise Management Platform (IPMS V9)
2014-05-07 10:02:00
EDA & Design Tools
Semiconductor IP News Archive - Page 814 of 1964
Peregrine Semiconductor Ships First UltraCMOS 10 Production Units
2014-05-07 09:37:00
SoC Architecture & Assembly
Silicon Image Completes Acquisition of UpdateLogic, Inc.
2014-05-07 09:26:00
Strategic Partnerships
Stars of IP Party Expands for DAC 2014 in San Francisco
2014-05-07 01:23:00
Misc
Imperas Announces ARMv8 ISS and ARMv8 Platform Roadmap
2014-05-06 17:19:00
SoC Architecture & Assembly
IP Cores, Inc. Announces NIST SP800-90B Update for Its True Random IP Cores
2014-05-06 11:03:00
IP Cores & Design
GUC Monthly Sales Report - April 2014
2014-05-06 09:35:00
Financials
AMD Unveils Ambidextrous Computing Roadmap
2014-05-06 09:13:00
SoC Architecture & Assembly
Wearables Need Tailored SoCs
2014-05-05 16:23:00
Analysis & Insight
Global Semiconductor Industry Posts Highest-Ever First Quarter Sales
2014-05-05 15:39:00
Analysis & Insight
Altera Customers Achieve Industry Milestone - Realizing 2X Core Performance Gain with Stratix 10 FPGAs and SoCs
2014-05-05 15:31:00
SoC Architecture & Assembly
DCD's I2C IP Core requires no programming
2014-05-05 13:51:00
IP Cores & Design
Kilopass to Exhibit at Five TSMC 2014 Technology Symposium Events in China, Taiwan, The Netherlands, Israel, Japan
2014-05-02 06:22:00
Misc
Mellanox Technologies Standardizes on Synopsys' Design Compiler Graphical
2014-05-01 16:37:00
EDA & Design Tools
ARM Holdings PLC Announces Retirement of CFO in May 2015
2014-05-01 14:29:00
People & Leadership
Xilinx Kintex UltraScale FPGAs are First 20nm Devices to Achieve PCI Express Compliance
2014-05-01 14:24:00
SoC Architecture & Assembly
Sonic Emotion Absolute 3D Sound Software Now Available on Cadence Tensilica HiFi Low-Power Audio/Voice Processors
2014-04-30 22:19:00
SoC Architecture & Assembly
CEVA, Inc. Announces First Quarter 2014 Financial Results
2014-04-30 22:15:00
Financials
Sidense 1T-OTP NVM Qualified in Second-Generation TSMC 180nm BCD Process
2014-04-30 22:05:00
IP Cores & Design
CEVA Unveils Bluetooth Solution for CEVA-TeakLite-4 DSP Targeting Low Power, Always-on, Smart Connected Devices
2014-04-30 22:00:00
IP Cores & Design