Cadence Announces Sensor Platforms as New Tensilica HiFi Audio Partner for Sensor Fusion and Context Awareness Applications
2014-02-18 09:32:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 816 of 1948
Semiconductor Unit Shipments To Exceed One Trillion Devices in 2016
2014-02-18 08:04:00
Analysis & Insight
Alizem releases its new Embedded Motor Control Software IP for Critical Applications
2014-02-18 07:39:00
Misc
M31 Technology Announces its USB 3.0 PHY Completed TSMC IP Validation
2014-02-18 07:14:00
IP Cores & Design
Big blues at IBM India
2014-02-18 06:16:00
Analysis & Insight
STMicroelectronics Reveals Affordable, Extensible Platform for Efficient Prototyping with STM32 Microcontrollers
2014-02-18 04:43:00
SoC Architecture & Assembly
Z3 Technology Announces 4K H.264 Video Encoder with Release of Z3-DM8169-4K-RPS System
2014-02-18 01:30:00
SoC Architecture & Assembly
M31 Technology USA is established
2014-02-18 01:24:00
Misc
Arteris Recruits World-Class Engineering Leadership Team
2014-02-18 01:20:00
People & Leadership
Xylon Expands Portfolio with the Face Detection and Tracking Computer Vision Technology
2014-02-17 16:50:00
IP Cores & Design
Are Processors Running Out Of Steam?
2014-02-17 16:13:00
Analysis & Insight
28nm Powers TSMC Forward
2014-02-17 16:06:00
Analysis & Insight
SMIC Reports 2013 Fourth Quarter Results
2014-02-17 15:18:00
Financials
Dolphin Integration Releases SmartLink, USB adapter for 80x51 Built-in Debugger
2014-02-17 12:12:00
SoC Architecture & Assembly
IBM invests in new $5bn chip fab in India, so is chip sale off?
2014-02-17 10:57:00
Analysis & Insight
End of Startup Era: Chips Face Innovation Gap
2014-02-17 10:42:00
Analysis & Insight
How Small Will Apple Inc. Go?
2014-02-17 09:57:00
Analysis & Insight
Leti and STMicroelectronics Demonstrate Order-of-Magnitude-Faster FD-SOI Ultra-Wide-Voltage Range DSP
2014-02-14 15:14:00
SoC Architecture & Assembly
Tabula Announces Availability of Stylus Compiler Version 2.8.2
2014-02-14 13:33:00
EDA & Design Tools
CEVA and Sensory Enable Power-Optimized Always-Listening Smart Wearables and Sensor Fusion Solutions via TrulyHandsfree 3.0 for CEVA-TeakLite-4 DSPs
2014-02-14 13:20:00
SoC Architecture & Assembly