Cadence Unveils Broad IP Portfolio for New TSMC 16nm FinFET Plus Process 2014-09-29 07:40:00 IP Cores & Design
Cadence Digital and Custom/Analog Tools Achieve TSMC Certification for 16FF+ Process, Companies Collaborate on 10nm FinFET 2014-09-29 02:42:00 EDA & Design Tools
Allegro DVT demonstrates its HEVC/H.265 Video Encoder IP and Compliance Streams at ARM TechCon 2014 2014-09-26 14:40:00 Misc
Leading-Edge IC Foundry Market Forecast to Increase 72% in 2014 2014-09-26 08:24:00 Analysis & Insight
Intel and Tsinghua Unigroup Collaborate to Accelerate Development and Adoption of Intel-based Mobile Devices 2014-09-26 08:08:00 Strategic Partnerships
Cadence to Demonstrate 16FF+ Design Solutions at TSMC 2014 OIP Ecosystem Forum 2014-09-26 07:23:00 Misc
Synopsys Tools Achieve TSMC Certification for 16-nm FinFET+ Process and Entered 10-nm FinFET Collaboration 2014-09-25 15:07:00 EDA & Design Tools
TSMC delivers first fully functional 16FinFET networking processor 2014-09-25 11:47:00 Foundries & Process Nodes
iPhone 6 Plus: $100 Costlier for Consumers to Buy - Just $15.50 More Expensive for Apple to Make 2014-09-25 08:44:00 Analysis & Insight
Xilinx Showcases All Programmable Solutions for Smarter Systems at ARM TechCon 2014 2014-09-25 06:02:00 Misc
Freescale Plans Extreme Performance for Kinetis MCUs with ARM Cortex-M7 Core 2014-09-24 17:40:00 SoC Architecture & Assembly
ChaoLogix Opening India Engineering Center To Meet Global Demand for ChaoSecure Technology That Boosts Semiconductor Chip Security 2014-09-24 17:28:00 Strategic Partnerships
PathPartner Technology Announces Industry's First Hybrid Hardware-Software HEVC Decoder Optimized for Programmable SoC Devices 2014-09-24 10:04:00 SoC Architecture & Assembly