U.S. Restricts EDA Software Sales to China
2025-05-30 23:03:00
Analysis & Insight
Semiconductor IP News Archive - Page 71 of 1964
Chevin are proud to be awarded runner-up of Arm Silicon Startups Contest 2025
2025-05-30 07:28:00
Strategic Partnerships
Synopsys Issues Statement in Connection with BIS Letter
2025-05-30 05:52:00
Strategic Partnerships
xMEMS Extends µCooling Fan-on-a-Chip to SSDs — Delivering First In-Drive Active Cooling for AI Data Centers and Laptop PCs
2025-05-29 15:42:00
SoC Architecture & Assembly
TSMC looks to 5nm MRAM, plans first European design centre
2025-05-29 15:13:00
Analysis & Insight
Innatera’s Pulsar Wins Best-in-Show at COMPUTEX 2025
2025-05-29 15:05:00
Misc
HPC Innovator Taps Aion Silicon for $12M RISC-V Accelerator Program
2025-05-29 14:53:00
Strategic Partnerships
BTQ Technologies and ICTK Sign Memorandum of Understanding to Advance Quantum-Secure Hardware Solutions
2025-05-29 09:24:00
Strategic Partnerships
oneNav Unveils World’s First L5-direct™ ASIC, Delivering More Than an Order of Magnitude Improvement in Jamming Resilience for Positioning and Timing, Leveraging GlobalFoundries’ 22FDX® Process Node
2025-05-29 08:28:00
SoC Architecture & Assembly
CEA Backs RISC-V for Sovereign, Scalable Computing
2025-05-29 07:02:00
Analysis & Insight
Synopsys Posts Financial Results for Second Quarter Fiscal Year 2025
2025-05-29 06:00:00
Financials
Post-Quantum Cryptography Coalition Unveils PQC Migration Roadmap
2025-05-28 15:55:00
Standards & Interconnects
Arteris Bridges Hardware-Software Gap with New EDA Tool
2025-05-28 15:49:00
Analysis & Insight
Ingonyama and Cornami Announce Strategic Collaboration to Accelerate High-Speed Cryptography
2025-05-28 14:09:00
SoC Architecture & Assembly
Silizium Circuits Achieves Successful Tape-Out of SC2391: Advancing GNSS and 5G Front-End Module Technology
2025-05-28 13:54:00
SoC Architecture & Assembly
SOC-E and Wind River Partner to Enable TSN Solutions on VxWorks
2025-05-28 13:46:00
SoC Architecture & Assembly
NVIDIA Expected to Launch RTX PRO 6000 Special Edition for China’s AI Market, Potentially Boosting Future GDDR7 Demand, Says TrendForce
2025-05-28 13:29:00
Analysis & Insight
TSMC to Open EU Design Center in Munich in Q3
2025-05-28 08:51:00
Analysis & Insight
EnSilica Establishes New Engineering Hub in Cambridge
2025-05-28 08:11:00
Strategic Partnerships
SCI Semiconductor raises £2.5m to develop security-enhanced microcontroller based on CHERI
2025-05-27 12:35:00
Strategic Partnerships