Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform
2017-10-12 13:12:00
Commercial Deals
Semiconductor IP News Archive - Page 561 of 1964
S3 Semiconductors selected to advance Satellite Transceiver Technology in ESA ARTES Partner Programme
2017-10-12 12:42:00
Strategic Partnerships
Gartner Says Worldwide Semiconductor Revenue to Reach $411 Billion in 2017
2017-10-12 10:36:00
Analysis & Insight
New MIPI Alliance Group Collaborates with Automotive Industry Experts to Address Interface Specifications for Automotive Applications
2017-10-12 03:40:00
Misc
GLOBALFOUNDRIES Introduces New Automotive Platform to Fuel Tomorrow's Connected Car
2017-10-12 03:18:00
Foundries & Process Nodes
QuickLogic Partners with AcconSys to Expand eFPGA Design Activity in China
2017-10-11 13:10:00
Strategic Partnerships
Cadence Achieves TUV SUD's First Comprehensive "Fit for Purpose - TCL1" Certification in Support of Automotive ISO 26262 Standard
2017-10-11 13:04:00
EDA & Design Tools
Mobiveil Announces 25xN RapidIO Specification 4.1 (25G) Digital Controller IP for Next-Generation Wireless Networking, High-Performance Computing Applications
2017-10-11 08:42:00
IP Cores & Design
Sankalp Semiconductor receives investment from Stakeboat Capital Fund
2017-10-11 07:15:00
Strategic Partnerships
NAGASE Partners with Accelize Extending FPGA Acceleration-as-a-Service to Complex Data Analytics
2017-10-10 17:19:00
SoC Architecture & Assembly
ArterisIP Joins GLOBALFOUNDRIES FDXcelerator Partner Program
2017-10-10 15:25:00
Strategic Partnerships
ACTT's Complete IoT Solution Now Available on SMIC 55nm eFlash Platform
2017-10-10 14:51:00
IP Cores & Design
Sandia National Laboratories Licenses Flex Logix's Embedded FPGA IP For Multiple Products
2017-10-10 14:47:00
Commercial Deals
Teradyne Standardizes on Cadence Xcelium Parallel Logic Simulator
2017-10-10 11:17:00
EDA & Design Tools
Report: TSMC's 3nm Fab Could Cost $20 Billion
2017-10-10 10:21:00
Analysis & Insight
Telco Systems, NXP and Arm Introduce New uCPE Offering
2017-10-10 10:15:00
SoC Architecture & Assembly
Near zero power consumption for RFID chips with Dolphin Integration's SESAME eLC standard cell library
2017-10-09 14:50:00
IP Cores & Design
SoC-e releases Multiport Time Sensitive Networking (TSN) IP Core
2017-10-09 12:47:00
IP Cores & Design
Faraday Monthly Consolidated Sales Report - September 2017
2017-10-09 12:35:00
Financials
AImotive Highlights Significant Limitations In Hardware And Benchmarks For Fully Autonomous Vehicles
2017-10-09 11:30:00
SoC Architecture & Assembly