Synopsys' New ARC Secure IP Subsystem Addresses Security Threats in Embedded SIM and Other High-Value Embedded Applications 2017-09-19 15:22:00 IP Cores & Design
ArterisIP Ncore Cache Coherent Interconnect and Resilience Package Licensed by NXP 2017-09-19 14:57:00 Commercial Deals
Synopsys Strengthens Design-Technology Co-Optimization Solution with Acquisition of QuantumWise 2017-09-19 14:52:00 Strategic Partnerships
Intel Custom Foundry Certifies Synopsys Design Platform for Intel's 22nm FinFET Low Power Process Technology 2017-09-19 14:48:00 EDA & Design Tools
Intel Technology and Manufacturing Day in China Showcases 10 nm Updates, FPGA Progress and Industry's First 64-Layer 3D NAND for Data Center 2017-09-19 14:42:00 Foundries & Process Nodes
SEGGER Adds Support for SiFive's Coreplex IP to Its Industry Leading J-Link Debug Probe 2017-09-19 14:36:00 SoC Architecture & Assembly
CoreHW accelerates growth - Panostaja invests in CoreHW by purchasing a majority shareholding 2017-09-19 14:32:00 Strategic Partnerships
Cadence Full-Flow Digital and Signoff Tools and Custom/Analog Tools Certified and Enabled for Intel 22FFL Process Technology 2017-09-19 14:27:00 EDA & Design Tools
AFuzion and HDL Design House Joint Webinar: Optimizing DO-254: October 4, 2017, 4 pm CEST 2017-09-19 14:16:00 Misc
Synopsys' New ARC IoT Development Kit Accelerates Software Development for Sensor Fusion, Voice Recognition and Face Detection Designs 2017-09-18 15:18:00 IP Cores & Design
TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event 2017-09-18 15:07:00 Misc
SMIC, Brite Semiconductor and Synopsys Collaborate to Deliver Low Power Platform for the Internet of Things 2017-09-18 11:04:00 Foundries & Process Nodes
Lattice Semiconductor's iCE40 FPGA Enables Low Latency and Concurrent Sensor Processing in SteamVR Tracking 2017-09-18 06:14:00 SoC Architecture & Assembly
Conversant Announces Semiconductor Memory Patent License Agreement With Toshiba 2017-09-18 05:28:00 Legal & IP Strategy
SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology 2017-09-15 09:38:00 Foundries & Process Nodes