"Black Swan" Event Triggers Revision to 2020 IC Market Forecast 2020-03-11 08:51:00 Analysis & Insight
OPENEDGES announces a strategic partnership with The Six Semiconductor Inc to provide a complete GDDR6 memory interface solution 2020-03-11 08:14:00 IP Cores & Design
Xilinx Announces World's Highest Bandwidth, Highest Compute Density Adaptable Platform for Network and Cloud Acceleration 2020-03-10 16:23:00 SoC Architecture & Assembly
Synopsys Custom Design Platform Secures Full-flow Displacement of Legacy Design Tools at Alphawave 2020-03-10 14:46:00 EDA & Design Tools
Ambiq Micro's Next-Generation Subthreshold Power-Optimized Technology (SPOT) Platform Features CEVA's Bluetooth Low Energy IP 2020-03-10 12:17:00 Commercial Deals
RISC-V Foundation Announces Ratification of the Processor Trace Specification 2020-03-09 18:19:00 Misc
Cadence Collaborates with STMicroelectronics on Networking, Cloud and Data Center Electronics 2020-03-09 16:22:00 Commercial Deals
Dover Microsystems and Cadence Partner to Deliver Secure Processing with Silicon-Layer Security for Mission-Critical Applications 2020-03-09 11:19:00 SoC Architecture & Assembly
MediaTek and Samsung Introduce World's First Wi-Fi 6 8K TV 2020-03-05 15:30:00 SoC Architecture & Assembly
Tessolve strengthens its VLSI Design services with the acquisition of T&VS 2020-03-05 13:21:00 Strategic Partnerships
UMC certifies Mentor product lines for its new 22nm ultra-low-power process technology 2020-03-05 08:29:00 EDA & Design Tools