Synopsys to Acquire Certain IP Assets of INVECAS
2020-01-08 01:49:00
Strategic Partnerships
Semiconductor IP News Archive - Page 406 of 1957
Omni Design Joins TSMC IP Alliance Program
2020-01-07 15:55:00
Strategic Partnerships
ESD Alliance Reports EDA Industry Revenue Increase for Q3 2019
2020-01-07 15:40:00
Analysis & Insight
Synopsys Releases Industry's First Bluetooth LE Audio Codec for Power-Sensitive Audio and Voice Applications
2020-01-07 15:14:00
IP Cores & Design
SHA IP Core with native SHA2-256 HMAC support
2020-01-07 14:23:00
IP Cores & Design
CEVA Speeds the Development of True Wireless Stereo Earbuds with its Support of Bluetooth LE Audio
2020-01-07 13:25:00
IP Cores & Design
SiFive and CEVA Partner to Bring Machine Learning Processors to Mainstream Markets
2020-01-07 12:09:00
Strategic Partnerships
LC3 for Bluetooth LE Audio Now Available for Cadence Tensilica HiFi DSPs
2020-01-07 08:27:00
SoC Architecture & Assembly
Bluespec, Inc. to Open Source Its Proven BSV High-level HDL Tools
2020-01-07 05:37:00
EDA & Design Tools
Siemens partners with Arm to accelerate the future of mobility by redefining design capabilities for complex electronic systems
2020-01-07 05:06:00
Strategic Partnerships
GUC Monthly Sales Report - Dec 2019
2020-01-06 13:37:00
Financials
Novatek Adopts CEVA Audio/Voice DSP and Software for Smart TV SoCs
2020-01-06 13:18:00
Commercial Deals
CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware IoT Devices
2020-01-06 13:11:00
IP Cores & Design
Gowin Semiconductor Takes Leadership Position in Always-on Low Power FPGAs with GW1NZ-ZV Device Production
2020-01-06 10:22:00
SoC Architecture & Assembly
zGlue Launches ChipBuilder Pro to Quickly and Easily Enable the Next Generation of Consumer Experiences on IoT and AI-Powered Devices
2020-01-06 06:42:00
EDA & Design Tools
Wi-Fi Alliance brings Wi-Fi 6 into 6 GHz
2020-01-03 15:20:00
Misc
OmniVision Announces 4K Video Processor with Industry's Lowest Power Consumption and HEVC Compression Capability for Battery-Powered Security and Surveillance Applications
2020-01-02 15:17:00
SoC Architecture & Assembly
Imagination and Apple Sign New Agreement
2020-01-02 07:27:00
Commercial Deals
HiSilicon No Longer Huawei's Captive Chipmaker
2020-01-02 06:26:00
Analysis & Insight
AImotive's latest aiWare3P delivers superior NN acceleration for production L2-L3 automotive AI
2019-12-30 13:44:00
IP Cores & Design