Rambus Delivers 112G XSR/USR PHY on TSMC 7nm Process for Chiplets and Co-Packaged Optics in Networking and Data Center 2020-06-18 07:00:00 IP Cores & Design
Synopsys Collaboration with Samsung Foundry Enables Rollout of Samsung SAFE Cloud Design Platform 2020-06-18 06:30:00 EDA & Design Tools
Distributed In-Chip Thermal Sensors Improve Multicore CPU Monitoring 2020-06-18 06:06:00 Analysis & Insight
Automotive IC Market Forecast With Strongest CAGR Through 2024 2020-06-18 03:55:00 Analysis & Insight
CREDO Announces Close of $100 Million Series D Preferred Financing as it Continues to Lead in High Performance Networking Connectivity Solutions 2020-06-17 13:41:00 Strategic Partnerships
Picocom selects UltraSoC in-system analytics and monitoring IP for 5G New Radio small cell SoC 2020-06-17 12:07:00 Commercial Deals
Agile Analog and EnSilica Collaborate to Improve Quality and Reliability of Microchips 2020-06-16 14:02:00 IP Cores & Design
Xilinx Announces Real-Time Server Appliances for High-Quality, Low-Cost Live Video Streaming 2020-06-16 02:29:00 SoC Architecture & Assembly
Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud 2020-06-16 01:36:00 EDA & Design Tools
Synopsys, TSMC and Microsoft Azure Deliver Highly Scalable Timing Signoff Flow in the Cloud 2020-06-15 17:04:00 EDA & Design Tools
IAR Systems enables secure code with updated MISRA C compliance in leading development tools 2020-06-15 15:42:00 SoC Architecture & Assembly
Dolphin Design unveils CHAMELEON, a revolutionary event-based MCU subsystem 2020-06-15 11:23:00 IP Cores & Design
NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform 2020-06-12 08:51:00 Foundries & Process Nodes