Esperanto Technologies Unveils Energy-Efficient RISC-V-Based Machine Learning Accelerator Chip
2021-08-25 13:34:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 318 of 1971
Synopsys Enables First-Pass Silicon Success for Achronix's New FPGA for Data and AI Acceleration Applications
2021-08-24 15:08:00
EDA & Design Tools
Imagination, update on 2021 progress
2021-08-24 10:52:00
Strategic Partnerships
eTopus Selects Diakopto's ParagonX Platform for Ultra-High Speed SerDes IP
2021-08-24 08:15:00
EDA & Design Tools
Engineering recruitment stepped up by surge in demand for ultra-low power memory solutions
2021-08-24 07:40:00
Strategic Partnerships
PragmatIC Semiconductor re-invents the iconic processor that changed the world
2021-08-24 04:28:00
SoC Architecture & Assembly
BAE Systems collaborates with GlobalFoundries to produce radiation-hardened single board computers for space
2021-08-23 16:36:00
Foundries & Process Nodes
Nvidia-Arm merger would substantially lessen competition says U.K. government report
2021-08-23 14:16:00
Analysis & Insight
ARM Nvidia deal goes to full investigation in the UK
2021-08-23 12:55:00
Analysis & Insight
Samsung Passes Intel to Become World's Largest Semi Supplier in 2Q21
2021-08-20 08:26:00
Analysis & Insight
Andes Technology and Cyberon Collaborate to Provide Edge-Computing Voice Recognition Solution on DSP-capable RISC-V Processors
2021-08-19 13:22:00
SoC Architecture & Assembly
Synopsys Posts Financial Results for Third Quarter Fiscal Year 2021
2021-08-19 12:40:00
Financials
Picocom Accelerates 5G Communications SoC Development with Cadence Palladium Emulation
2021-08-19 02:27:00
EDA & Design Tools
Rambus Completes Acquisition of PLDA
2021-08-18 15:25:00
Strategic Partnerships
Arasan Chip Systems announces its 2'nd Generation Sureboot QSPI IP
2021-08-18 08:36:00
IP Cores & Design
Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications
2021-08-18 07:49:00
IP Cores & Design
Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready Memory Subsystem
2021-08-17 08:30:00
IP Cores & Design
BrainChip Receives Akida Chips from Socionext America
2021-08-17 08:19:00
IP Cores & Design
CSEM and USJC team up to develop an ultra-low-power chip
2021-08-17 06:43:00
IP Cores & Design
Major Update to MIPI DSI-2 Specification Enables Advancements in Mobile Displays
2021-08-17 06:22:00
Misc