GUC Monthly Sales Report - May 2021
2021-06-07 12:44:00
Financials
Semiconductor IP News Archive - Page 317 of 1957
NVM Express Announces the Rearchitected NVMe 2.0 Library of Specifications
2021-06-07 12:32:00
Misc
Palma Ceia SemiDesign Announces New Wi-Fi HaLow Chips, PCS2100 and PCS2500 - Ideal for Industry 4.0
2021-06-07 12:27:00
SoC Architecture & Assembly
UMC Reports Sales for May 2021
2021-06-07 05:48:00
Financials
Synopsys Expands Multi-Die Solution Leadership with Industry's Lowest Latency Die-to-Die Controller IP
2021-06-03 15:13:00
IP Cores & Design
TSMC's Zhang: Automotive is Going HPC
2021-06-03 13:53:00
Analysis & Insight
intoPIX delivers JPEG XS Compressed Solutions for Low Latency Video Streaming with NVIDIA GPUs
2021-06-03 10:57:00
SoC Architecture & Assembly
Texas Instruments Continues As World's Top Analog IC Supplier
2021-06-03 10:51:00
Analysis & Insight
Sondrel launches the fourth IP platform - SFA 350A - that delivers faster time to market for ADAS ASICs
2021-06-03 09:39:00
IP Cores & Design
Brite Semiconductor Releases ONFI 4.2 IO and Physical Layer IP based on SMIC 14nm FinFET Process
2021-06-03 09:28:00
IP Cores & Design
SmartDV Announces Support for ARINC Standards with Design and Verification IP
2021-06-03 07:18:00
IP Cores & Design
Siemens enhances Nucleus ReadyStart for Arm platforms with enhanced debug, security and stability features
2021-06-03 06:09:00
SoC Architecture & Assembly
EdgeCortix Collaborates with Cadence to Accelerate AI Chip Design
2021-06-03 01:14:00
EDA & Design Tools
Arm empowers MCU software developers to capitalize on IoT potential
2021-06-02 15:39:00
SoC Architecture & Assembly
PLDA and AnalogX Announce Market-leading CXL 2.0 Solution featuring Ultra-low Latency and Power
2021-06-02 13:26:00
IP Cores & Design
NXP Ramps Automotive Processing Innovation with Two Processors on TSMC 16nm FinFET Technology
2021-06-02 13:22:00
Foundries & Process Nodes
PUFsecurity and Andes Technology Cooperate to Integrate Crypto Coprocessor PUFiot into RISC-V AIoT Security Platform
2021-06-02 09:27:00
IP Cores & Design
TSMC Unveils Innovations at 2021 Online Technology Symposium
2021-06-02 07:38:00
Foundries & Process Nodes
Aldec Launches HES-DVM Proto "Cloud Edition" - Giving Engineers Easier Access to FPGA-based ASIC & SoC Prototyping
2021-06-02 06:53:00
EDA & Design Tools
First step in its Multi-Codec HEVC and VVC Platform Initiative
2021-06-02 05:58:00
Legal & IP Strategy