Flex Logix Appoints Lee Leibig As Vice President Of Sales For AI Inference 2021-08-25 15:20:00 People & Leadership
Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem 2021-08-25 14:21:00 Foundries & Process Nodes
CAES to Enable Critical Infrastructure for Next Generation Lunar Landers 2021-08-25 13:37:00 Commercial Deals
Esperanto Technologies Unveils Energy-Efficient RISC-V-Based Machine Learning Accelerator Chip 2021-08-25 13:34:00 SoC Architecture & Assembly
Synopsys Enables First-Pass Silicon Success for Achronix's New FPGA for Data and AI Acceleration Applications 2021-08-24 15:08:00 EDA & Design Tools
eTopus Selects Diakopto's ParagonX Platform for Ultra-High Speed SerDes IP 2021-08-24 08:15:00 EDA & Design Tools
Engineering recruitment stepped up by surge in demand for ultra-low power memory solutions 2021-08-24 07:40:00 Strategic Partnerships
PragmatIC Semiconductor re-invents the iconic processor that changed the world 2021-08-24 04:28:00 SoC Architecture & Assembly
BAE Systems collaborates with GlobalFoundries to produce radiation-hardened single board computers for space 2021-08-23 16:36:00 Foundries & Process Nodes
Nvidia-Arm merger would substantially lessen competition says U.K. government report 2021-08-23 14:16:00 Analysis & Insight
Samsung Passes Intel to Become World's Largest Semi Supplier in 2Q21 2021-08-20 08:26:00 Analysis & Insight
Andes Technology and Cyberon Collaborate to Provide Edge-Computing Voice Recognition Solution on DSP-capable RISC-V Processors 2021-08-19 13:22:00 SoC Architecture & Assembly
Picocom Accelerates 5G Communications SoC Development with Cadence Palladium Emulation 2021-08-19 02:27:00 EDA & Design Tools
Arasan Chip Systems announces its 2'nd Generation Sureboot QSPI IP 2021-08-18 08:36:00 IP Cores & Design
Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications 2021-08-18 07:49:00 IP Cores & Design