IAR Systems extends functional safety offering for RISC-V with leading build tools for Linux 2021-10-25 06:28:00 SoC Architecture & Assembly
North American Semiconductor Equipment Industry Posts September 2021 Billings 2021-10-25 01:42:00 Analysis & Insight
Vidatronic Joins the Silicon Catalyst Semiconductor Ecosystem as an In-Kind Partner 2021-10-22 15:15:00 Misc
Silex Insight offers low-power embedded video solution for manufacturing and automotive 2021-10-21 11:43:00 IP Cores & Design
Flex Logix Announces Production Availability Of InferX X1 PCIe Boards for Edge AI Systems 2021-10-21 07:53:00 SoC Architecture & Assembly
BrainChip Begins Taking Orders of Akida AI Processor Development Kits 2021-10-21 07:46:00 SoC Architecture & Assembly
Siemens accelerates IP validation by 1,000X at Arm using ML-powered Solido Variation Designer on AWS Graviton2 2021-10-21 05:21:00 EDA & Design Tools
Green Hills Software Creates Clear Path for Arm Cortex-A78AE Early Adopters in High-Performance Critical Embedded Systems 2021-10-21 02:13:00 SoC Architecture & Assembly
Cadence Demonstrates IP Test Silicon for PCI Express 6.0 Specification on TSMC N5 Process 2021-10-21 01:47:00 IP Cores & Design
Cadence Digital and Custom/Analog Flows Achieve the Latest TSMC N3 and N4 Certifications 2021-10-21 01:00:00 EDA & Design Tools
Synopsys Expands Strategic Technology Collaboration with TSMC to Extend 3D-System Integration Solutions for Next-Generation High-Performance Computing Designs 2021-10-20 15:08:00 EDA & Design Tools
NSCore, Inc. introduces its OTP+ solution to address the IoT market need for an Ultra-Low-Power OTP NVM IP Solution in 40nm 2021-10-20 08:00:00 IP Cores & Design
Enyx releases nxFramework version 5.4 for subscribers which includes new ULL IP cores and 40G support 2021-10-20 07:11:00 IP Cores & Design
De-RISC, the H2020 project which will create the first RISC-V fully European platform for aerospace, celebrates its second anniversary 2021-10-20 06:37:00 Misc
Synopsys Digital and Custom Design Platforms Achieve Certification for TSMC N3 Process 2021-10-20 06:12:00 EDA & Design Tools
eTopus introduces 400G(4x100G) LR IP solution incorporating new FEC & ePHY with combined latency of sub 10ns 2021-10-19 15:20:00 IP Cores & Design
Omni Design Announces Silicon Validated Data Converters on TSMC 16nm Process 2021-10-19 15:00:00 IP Cores & Design
GlobalFoundries Announces Launch of Initial Public Offering 2021-10-19 13:24:00 Strategic Partnerships