Introducing DDR5/DDR4/LPDDR5 Combo PHY IP Core, Silicon Proven in 12FFC for Next-Gen High performance SoCs is available for immediate licensing 2022-03-28 13:23:00 IP Cores & Design
Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services 2022-03-24 16:40:00 EDA & Design Tools
The Semiwise's Flat Field Transistor enables the continuation of DRAM scaling 2022-03-24 16:40:00 EDA & Design Tools
Amid Rising Volume and Pricing, Top 10 IC Design Companies Post 2021 Revenue Topping US$100 Billion 2022-03-24 16:40:00 Analysis & Insight
CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale 2022-03-24 16:39:00 Misc
Intrinsic ID PUF Technology Now Fully Compatible with OpenTitan Root of Trust to Strengthen Device Level Security 2022-03-23 13:03:00 SoC Architecture & Assembly
Andes and IAR Systems Enable Leading Automotive-Focused IC Design Companies to Accelerate Time to Market 2022-03-22 09:44:00 SoC Architecture & Assembly
Avalanche Technology and Efabless Partner for System-On-Chip Development using Google's Open-Source Program 2022-03-22 09:38:00 Strategic Partnerships
CAES Introduces Family of Radiation Hardened NOR Flash Memories for Space FPGAs 2022-03-21 15:18:00 SoC Architecture & Assembly