China forms its own chiplet standard amid isolation
2023-03-30 13:48:00
Analysis & Insight
Semiconductor IP News Archive - Page 210 of 1970
Computing Hardware Expert Georgios Konstadinidis Joins proteanTecs Advisory Board
2023-03-30 09:11:00
People & Leadership
Synopsys.ai Unveiled as Industry's First Full-Stack, AI-Driven EDA Suite for Chipmakers
2023-03-29 14:08:00
EDA & Design Tools
Veriest Solutions Promotes Dusica Glisic to Vice President of Frontend Engineering
2023-03-29 13:28:00
People & Leadership
Report: Arm proposes change to IP royalty model
2023-03-29 12:27:00
Analysis & Insight
Networking Chip Startup Enfabrica Emerges from Stealth Mode to Solve Scalability and Price-Performance Challenges for AI Growth in Cloud
2023-03-29 12:04:00
Strategic Partnerships
Tachyum To Use UCIe Interconnect Standards In Prodigy 2
2023-03-29 11:21:00
Misc
Mobiveil's PSRAM Controller IP Lets SoC Designers Leverage AP Memory's Xccela x8/x16 250 MHz PSRAM Memory
2023-03-28 15:28:00
IP Cores & Design
eMemory and UMC Expand Low-Power Memory Solutions for AIoT and Mobile Markets with 22nm RRAM Qualification
2023-03-28 08:38:00
IP Cores & Design
2026 All-Time High in Store for Global 300mm Semiconductor Fab Capacity After 2023 Slowdown, SEMI Reports
2023-03-27 15:59:00
Analysis & Insight
Designing MPUs/MCUs with Functional Safety
2023-03-27 15:36:00
Analysis & Insight
Sensor Fusion Explores AI to Prep for ADAS, AV Designs
2023-03-27 15:34:00
Analysis & Insight
MIPI A-PHY Specification Levels Up In-Vehicle Connectivity
2023-03-27 15:26:00
Analysis & Insight
Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 22nm ULP is Available for Immediate Licensing for Smart Audio Chipsets
2023-03-27 10:26:00
Misc
Alphawave Semi Opens Pune Office, Continues Expansion into India
2023-03-24 08:52:00
Strategic Partnerships
SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speck™" to mass production
2023-03-23 16:47:00
Strategic Partnerships
Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports
2023-03-23 16:46:00
Analysis & Insight
OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip
2023-03-23 07:29:00
IP Cores & Design
Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration
2023-03-23 07:04:00
SoC Architecture & Assembly
CEO Interview: Ian Lankshear, EnSilica
2023-03-23 06:39:00
Analysis & Insight