Monthly Semiconductor Sales Decrease 0.5% Globally in September 2022-10-31 08:47:00 Analysis & Insight
EnSilica growth continues with new Bristol ASIC design office 2022-10-31 08:40:00 Strategic Partnerships
MIPI DSI and CSI Controllers IP Cores, for your High-Resolution Cameras, Display and Consumer Products, is available for immediate licensing 2022-10-31 02:40:00 Misc
Xiphera provides versatility and compact footprint with two new SHA-3 IP cores 2022-10-28 15:22:00 IP Cores & Design
Vidatronic Releases FlexSIMO™ DC-DC Converter Technology for Highly Efficient Power Delivery in IoT, AR/VR, and Metaverse SoCs 2022-10-28 08:33:00 IP Cores & Design
Report: TSMC stops work on Chinese AI chip amid sanctions confusion 2022-10-27 16:50:00 Analysis & Insight
TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations 2022-10-27 16:49:00 Foundries & Process Nodes
Siemens partners with TSMC for 3nm product certifications and other technology milestones 2022-10-27 16:48:00 EDA & Design Tools
Blueshift Memory Awarded Innovate UK Smart Grant to Develop AI Computer Vision Module 2022-10-27 16:48:00 Strategic Partnerships
Synopsys, Ansys and Keysight Accelerate 5G/6G SoC Designs with New mmWave Reference Flow for TSMC Process Technology 2022-10-27 16:47:00 EDA & Design Tools
Synopsys Collaborates with TSMC to Unleash System Innovation with Most Comprehensive Multi-Die Design Solutions for TSMC's Advanced Technologies 2022-10-27 16:47:00 EDA & Design Tools
Cadence Accelerates RF Design with Delivery of New TSMC N16 mmWave Reference Flow 2022-10-27 16:47:00 EDA & Design Tools
Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings 2022-10-27 16:47:00 EDA & Design Tools
SiMa.ai Welcomes New Investor MSD Partners Bringing Total Investment to $187 Million - SiMa.ai extends oversubscribed series B1 funding to $67 Million 2022-10-27 16:47:00 Strategic Partnerships
Zynq® UltraScale+™ MPSoC FPGA: REFLEX CES adds a new FPGA version to its Zeus Zynq® UltraScale+™ MPSoC System-on-module 2022-10-27 16:47:00 SoC Architecture & Assembly
Cadence's New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies 2022-10-27 10:00:00 EDA & Design Tools
GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring 2022-10-27 08:56:00 Commercial Deals
Flex Logix EFLX4K eFPGA IP Core on TSMC 7nm Technology Now Available 2022-10-26 14:08:00 IP Cores & Design