Imperas at the RISC-V Summit Europe, June 5-9 2023
2023-06-05 06:30:00
Misc
Semiconductor IP News Archive - Page 197 of 1970
Dolphin Design Selects Imperas for Processor Functional Design Verification
2023-06-05 06:04:00
EDA & Design Tools
Silicon Proven 12bit 1Gsps DAC IP Core designed for Wireless RF Applications is available for immediate license
2023-06-05 01:00:00
Misc
Axiomise Launches Next-Generation formalISA App for RISC-V Processors
2023-06-02 05:55:00
EDA & Design Tools
Semidynamics announces largest, fully customisable Vector Unit in the RISC-V market, delivering up to 2048b of computation per cycle for unprecedented data handling
2023-06-01 16:48:00
IP Cores & Design
NVIDIA Collaborates With SoftBank Corp. to Power SoftBank's Next-Gen Data Centers Using Grace Hopper Superchip for Generative AI and 5G/6G
2023-06-01 16:46:00
Strategic Partnerships
Vtool appoints Incusolution to be its sales-channel partner in Korea
2023-06-01 16:45:00
Strategic Partnerships
Tachyum Testing Applications on Prodigy FPGA
2023-06-01 16:45:00
SoC Architecture & Assembly
Xiphera extends its Transport Layer Security product family
2023-06-01 16:45:00
IP Cores & Design
The game-changing addition of intoPIX JPEG XS codec by Providius heralds a new era of IP media analysis
2023-06-01 16:45:00
Commercial Deals
UltraRISC Selects Valtrix STING for Verification of RISC-V SoC Designs
2023-06-01 16:45:00
Commercial Deals
University of Oklahoma Joins the BrainChip University AI Accelerator Program
2023-06-01 16:43:00
Misc
Industry Leaders Launch RISE to Accelerate the Development of Open Source Software for RISC-V
2023-06-01 15:45:00
SoC Architecture & Assembly
The Six Semiconductor of OPENEDGES Joins Canada's Semiconductor Council
2023-06-01 11:20:00
Misc
Intel Foundry Services Ushers in a New Era
2023-05-31 16:43:00
Foundries & Process Nodes
Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future
2023-05-31 10:40:00
Strategic Partnerships
Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era
2023-05-31 08:52:00
SoC Architecture & Assembly
U.S. Government Accredits GlobalFoundries to Manufacture Trusted Semiconductors at New York Facility
2023-05-30 15:24:00
Foundries & Process Nodes
MIPS Leverages Siemens' Veloce proFPGA platform to Implement and Make Available Capabilities of its New High-Performance eVocore P8700 RISC-V Multiprocessor
2023-05-30 10:05:00
EDA & Design Tools
Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions
2023-05-30 09:06:00
Strategic Partnerships