Enable Customers' Fastrack to USB 3.0, Faraday Pioneers to Launch Its USB 3.0 PHY in UMC 0.13um 2009-05-14 14:47:00 IP Cores & Design
Tundra Semiconductor Announces RapidIO System Modeling Tool 2009-05-14 10:57:00 SoC Architecture & Assembly
Monotype Imaging and TAKUMI to Unveil OpenVG Text Solution 2009-05-12 18:09:00 SoC Architecture & Assembly
Mentor Graphics Delivers First HDTV Platform for the Accelerated Verification of HDMI and DisplayPort Products 2009-05-12 18:02:00 SoC Architecture & Assembly
Open-Silicon, Inc. Executes NXP Product Development in Record Time 2009-05-12 17:50:00 SoC Architecture & Assembly
Jennic Achieves ZigBee Compliant Platform (ZCP) Certification 2009-05-12 11:56:00 SoC Architecture & Assembly
eASIC Announces Low-Cost, Single-Chip High Definition H.264 Codec 2009-05-11 19:54:00 SoC Architecture & Assembly
TAKUMI Starts Licensing New Graphics Accelerator IP cores supporting 2D Vector Graphics 2009-05-11 14:59:00 IP Cores & Design
Actions Semiconductor and Dolphin Integration enable a solution for the next generation of portable audio players 2009-05-11 14:39:00 Commercial Deals
New Xilinx Virtex-5Q FPGA Family Delivers Higher Performance and Advanced Security Technologies for Defense Systems 2009-05-11 13:51:00 SoC Architecture & Assembly
CEVA Partners with SMIC to Deliver Fully Functional Silicon for CEVA-TeakLite-III DSP Core 2009-05-11 13:17:00 IP Cores & Design
Rad3 Communications announces the acquisition of Raithlin Semiconductor's LDPC IP Cores and development team 2009-05-11 12:01:00 Strategic Partnerships