YorChip announces Low Latency 200G Chiplet for edge AI
2024-06-19 06:42:00
Misc
Semiconductor IP News Archive - Page 108 of 1948
Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024
2024-06-19 06:22:00
IP Cores & Design
Intel 3 Represents an Intel Foundry Milestone
2024-06-18 16:49:00
Foundries & Process Nodes
QuickLogic Joins Intel Foundry Accelerator IP and USMAG Alliance Programs
2024-06-18 15:30:00
Strategic Partnerships
Sequans Announces a New $15 Million Licensing Agreement
2024-06-18 13:42:00
Strategic Partnerships
Faraday to Exhibit Next-gen ASIC Solutions at DAC 2024
2024-06-18 10:35:00
Misc
Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter, featuring superior output power and energy efficiency
2024-06-17 16:00:00
Misc
Initial members join CHERI Alliance to drive adoption of memory safety and scalable software compartmentalization
2024-06-17 15:50:00
Misc
SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
2024-06-17 15:38:00
Strategic Partnerships
Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024
2024-06-17 09:51:00
Foundries & Process Nodes
Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure
2024-06-13 14:30:00
IP Cores & Design
Consortium led by Crosshill Oy signs defense technology development agreement for F-35 Program with Lockheed Martin
2024-06-13 13:35:00
Strategic Partnerships
Synopsys Achieves Certification of its AI-driven Digital and Analog Flows and IP on Samsung Advanced SF2 GAA Process
2024-06-13 07:20:00
IP Cores & Design
ADTechnology announces next-generation platform "ADP600" at Samsung Foundry Forum 2024
2024-06-13 05:57:00
IP Cores & Design
Flow Computing Emerges from Stealth with Licensable, On-Die Parallel Processing Enabling 100X Improved Performance For Any CPU Architecture
2024-06-13 05:09:00
Strategic Partnerships
Sondrel secures major funding today
2024-06-13 04:28:00
Strategic Partnerships
Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications
2024-06-13 03:30:00
EDA & Design Tools
Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry's newest processes
2024-06-13 03:21:00
EDA & Design Tools
Rambus Unveils PCIe 7.0 IP Portfolio for High-Performance Data Center and AI SoCs
2024-06-12 19:17:00
IP Cores & Design
Alphawave Semi to Showcase Next-Generation PCIe® 7.0 IP Platform for High-Performance Connectivity and Compute at PCI-SIG® DevCon 2024
2024-06-12 18:51:00
IP Cores & Design