Aliathon announces 100G Transponder & Muxponder Demo Design
April 5, 2012 -- Aliathon announces the immediate availability of our 100G OTN dual Transponder / Muxponder demo design recently demonstrated to customers at OFC 2012.
This demo design platform has been engineered to give our clients an easy-to-use, flexible and feature-rich experience that accelerates their product introduction in to the 100G OTN market. The design is available for evaluation in both the Aliathon and Xilinx engineering labs.
Headline Features
- Compliant to ITU G.709 Standard.
- Architected to fit comfortably inside a single-chip FPGA .
- 200MHz+ Push Button Core Performance.
- Scales to Future OTN Rates (n x 100G, 400G).
- CAUI Client / OTL4.10 Line Side Interfaces.
- 100GE & 10G clients Mapped in to OTU4 Payload via GMP.
- 100G & 10G Framing & Section/Path OH Processing.
- Support for generic G.709 FEC.
- 7db NECG @ 6.7% OH G.709 Standard GFEC.
- 100G Transponderare delighted to Demo Design Product Brief
- 100G Muxponder Demo Design Product Brief
Target Applications.
Target applications include 100GE long-haul transport and metro / router network aggregation.
Later in 2012 Aliathon will be rolling out our other 100G reference design platforms. See below the basic architectures of these solutions.
- 100G Regenerator/Repeater.
- Interlaken - OTU4 Transponder.
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Altera's Stratix IV GT FPGA Selected by NEC for Use in Advanced 100G Transponder Card for DWDM System
- Avalon and AppliedMicro Enable Efficient 100G Muxponder Applications
- Aliathon Ltd. Announces the immediate availability of their 100G OTN Transponder Reference Design For XILINX FPGAs.
- Altera's Stratix V FPGAs Break Through Performance Barriers with Industry's First Single-Chip, Dual 100G Transponder
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release