The Future Of Process Is Wide Open
June 17, 2013
The options for the future of process technology are still wide open with three choices: finfet on bulk, finfet on SOI and planar FD-SOI, says Asen Asenov, Professor of Electronics and Electrical Engineering at Glasgow University and CEO of Gold Standard Simulations, the leading CMOS statistical variability company.
“It’s a battle between Intel and IBM – between SOI finfet and bulk finfet,” Asenov told EW, “while ST’s FD-SOI offers a very good low power solution. FD-SOI in terms of simplicity has advantages.”
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