The Future of Fabless Design?
Lately, there has been a rise in predictions that the fabless business model is “dying”, or “collapsing”, or simply that it “no longer works”. The main argument centers on the disconcerting fact that a disaggregated supply chain makes optimization of the semiconductor product increasingly difficult to achieve, especially when coupled with the inherent complexity of advanced process nodes and leading-edge designs. In particular, the data interfaces between design teams, foundries, and EDA vendors are becoming increasingly complex. The result is a dramatic increase in cost, and more importantly, risk.
To read the full article, click here
Related Semiconductor IP
- SpaceWire Node IP core
- nQrux Secure Boot
- 4K/8K Multiformat IP supporting AV2 decoder
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
Related Blogs
- Maximizing the Usability of Your Chip Development: Design with Flexibility for the Future
- Building Smarter, Faster: How Arm Compute Subsystems Accelerate the Future of Chip Design
- Cadence at the TSMC OIP: Pioneering the Future of Semiconductor Design
- Shaping the Future of Semiconductor Design Through Collaboration: Synopsys Wins Multiple TSMC OIP Partner of the Year Awards
Latest Blogs
- A Repeatable Framework for Hardware Security Assurance
- Inside the SiFive Performance™ P570 Gen 3: High Performance Efficiency for Next-Generation Consumer and Commercial Applications
- What the steam engine can teach us about modern chip design
- Automotive silicon in the era of AI, functional safety, and cybersecurity
- JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA