QFN Package Overview
January 21, 2013
QFN package is probably the most successful package type today. QFN package offers low price, excellent performance and small size –therefore it is an ideal package for many applications.
QFN (quad-flat no-leads) is a plastic SMT package consists of: a leadframe, single or multiple dies, wirebonds and a molding compound. The leadframe is the heart of the package and therefore the size and the dimensions of the leadframe will determine the overall performance of the package.
Related Semiconductor IP
- Adaptive Voltage Scaling (AVS) Bus Target IP
- Adaptive Voltage Scaling (AVS) Bus Host Controller
- NoC Interconnect IP Generator
- Over-Voltage Lockout (OVLO) IP
- Verification IP for Universal Chiplet Interconnect Express (UCIe) up to 3.0
Related Blogs
- Semiconductor IP Sector Overview
- PLD Overview: Xilinx and Altera
- Semiconductor Sector Overview: MRVL, IDCC, ARM, TSRA
- Can You Save 15% of you ASIC Package Cost Today? Hint: Wirebonds
Latest Blogs
- Building the engine behind Arm’s silicon shift
- M31 High-Speed and Long-Channel MIPI C/D-PHY Solution on TSMC N3P/N3C
- Understanding security certification and how analog IP can help
- Embedded Security explained: Secure boot for embedded systems
- World's First Standards-Compliant 112G PHY IP for Linear Optics: A Turning Point for AI Interconnects