Building the Cars of the Future

By _Cadence - Cadence IP Blog

July 18, 2016

The big buzz in the automotive industry lately is autonomous driving vehicles. Companies like Mercedes, BMW, Google, and Tesla have already released, or are soon to release, self-driving features that give the car some ability to drive itself. Several other companies are also currently working on this technology. As a result, future cars will be equipped with sensor clusters, more computing power, Car2X communication technology (also known as vehicle-to-vehicle and vehicle-to-infrastructure communication), high-bandwidth Ethernet networks, and more than 15 high-definition (HD) displays.

Lack of space, reduction of power and weight (emissions), and cost savings is pushing automotive suppliers to integrate much more functionality on a chip rather than on a PCB. By leveraging new advanced semiconductor process technologies like 40nm G, 28nm FD-SOI, and 10nm and 7nm FinFET, in combination with dedicated design IP and packaging technology, a new class of automotive systems on chip (SoCs) or systems in package (SiPs) will dramatically change the architecture of future high-integration engine control units (ECUs). These changes will greatly enhance vehicle performance, efficiency, reliability, and safety of future vehicles.

Three of the most used protocol standards in automotive electronics are CAN, LIN, and Ethernet AVB.

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