"Under the hood" of Altera's 20nm offerings
Last week, the folks at Altera unveiled several of the key innovations they have planned for their next generation of products, which will be implemented at the 20nm technology node (Click Here to see that column: Altera unveils innovations at the 20nm node).
Amongst other things, they talked about 40-Gbps Chip-to-Chip and 28-Gbps backplane transceivers, heterogeneous 3D ICs featuring a high-speed chip-to-chip interface, and next-generation DSP performance with the highest TFLOPs/watt.
Well, a couple of days ago, I had a chat with Misha Burich, Senior Vice President and Chief Technical Officer (CTO) at Altera. Misha was extremely open and forthcoming, and I learned myriad tidbits of trivia and nuggets of knowledge of which I was previously unaware…
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