3D and power is all wet

By _EDN Practical Chip Design

July 23, 2012

There has been a lot of talk recently about 3D ICs and the challenges associated with them. One area that contains some of the biggest challenges is related to power – how do you get power in and how do you get the heat generated back out again. To understand this a little more, I talked to Madhavan Swaminathan who is the Joseph M. Pettit Professor in Electronics at the School of Electrical and Computer Engineering and Director of the Interconnect and Packaging Center (IPC), an SRC Center of Excellence, at Georgia Tech, Atlanta. He is also the Founder and CTO of E-System Design.

I featured the introductory chapter of his book “Power Integrity Modeling and Design for Semiconductors and Systems” during my EDA Designline series about power in April. This book chapter provides a good background into the power delivery network and its analysis.

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