Alvand Technologies Offers Analog Mixed-Signal IP in 28nm Process
Santa Clara, California -- October 05, 2011 -- Alvand Technologies a leading analog and mixed signal IP provider, today announced that it will be offering Analog Front End (AFE) IP for wireless (MIMO) applications in GLOBALFOUNDRIES' 28nm foundry process.
This announcement follows Alvand’s previously introduced MIMO AFE IP in 40LP process. This is Alvand’s fifth-generation MIMO AFE IP, having previously offered its IP in 130nm, 90nm, 65nm and 40nm process nodes. Alvand’s Wireless MIMO IP has been successfully integrated into multiple IC products by manufacturers worldwide across different foundries. MIMO AFE modules are widely integrated into SoCs that target high-bandwidth wireless applications, including Wi-Fi, Wi-MAX and LTE mobile phone transceivers.
Alvand’s highly integrated Wireless MIMO AFE IP includes two 12-bit ADC cores, two 12-bit DAC cores, one 10-bit auxiliary ADC, one 10-bit auxiliary DAC and a low-jitter PLL. The IP is designed for extremely low-power operation for companies developing next-generation devices for high-volume wireless applications. It has been successfully integrated into multiple IC products that have entered mass production at manufacturers worldwide.
Alvand is a member of the GLOBALSOLUTIONS™ program, an open and collaborative program to leverage the best IP, EDA, design services, mask making and assembly and test resources from around the world to deliver optimized solutions to the customers.
About Alvand Technologies, Inc.
Alvand Technologies is a leading analog IC design company that specializes in high-speed, low-power, and ultra small die area data converters (ADC/DAC) and Analog Front End (AFE) for a broad range of applications, such as wireless (LTE,Wi-MAX,Wi-Fi) systems, ultrasound and mobile TV. Alvand also provides full turnkey mixed-signal ASICs based on its high performance and low power IPs. For more information visit us at www.alvandtech.com
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- NFC wireless interface supporting ISO14443 A and B on SMIC 180nm
- 802.11i Wireless Security Cores
- Multi-protocol wireless platform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- LDPC Decoder for 5G NR and Wireless
Related News
- Cosmic Circuits announces its WiMO AFE platform for MIMO WiFi and WiMax SoCs
- GlobalFoundries and Microchip Announce Microchip's 28nm SuperFlash® Embedded Flash Memory Solution in Production
- GlobalFoundries Expands Partnership with Apple to Advance Wireless Connectivity and Power Management, Reinforcing U.S. Chip Manufacturing Leadership
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
Latest News
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs