Vendor: Ceva, Inc. Category: Bluetooth

Multi-protocol wireless platform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)

The Ceva-Waves Links200 is a fully integrated multi-protocol wireless platform in TSMC 12nm FFC+ supporting Bluetooth High Data T…

Overview

The Ceva-Waves Links200 is a fully integrated multi-protocol wireless platform in TSMC 12nm FFC+ supporting Bluetooth High Data Throughput and IEEE 802.15.4 for Zigbee, Thread and Matter compliance. It pre-integrates all the necessary hardware, software and radio components for a cost effective, low power and high-performance solution to enable the development of advanced smart edge AI SoC in an easy and fast time to market manner. Compliant with Bluetooth 6.0, Links200 supports a comprehensive feature set including Audio streaming (Classic Audio, LE Audio, Auracast Broadcast Audio) with High Data Throughput mode for next generation lossless multi-channel LE Audio streaming, Localization including AoA/AoD for Direction Finding and Channel Sounding for accurate and secure ranging, Low latency mode for gaming supporting up to 8KHz refresh rate.

The first member of the Ceva-Waves Links family, the Links100, is an integrated Wi-Fi 6 + Bluetooth 5.4 + 802.15.4 multi-protocol subsystem IP targeted for low power IoT applications.

Key features

  • Full Bluetooth dual mode (Classic and LE) support, including next generation High Data Throughput up to 7.5Mbps for lossless multichannel low latency audio streaming.
  • IEEE 802.15.4 support, for Zigbee, Thread and Matter
  • Comprehensive Integration: Includes RF, modem, controller, software stacks, and profiles.
  • Advanced Audio Support: Supports Classic Audio, LE Audio, and Auracast Broadcast Audio.
  • Accurate and Secure Ranging: Supports Bluetooth Channel Sounding for precise and secure ranging.
  • Optimized Process: Utilizes TSMC 12nm FFC+ process, ideal for advanced smart audio and Smart Edge AI SoCs.
  • Superior Performance: Fully featured with best-in-class power consumption, die size, and performance, with state-of-the-art RF architecture requiring minimal external components for low bill of materials.
  • Ease of Integration: Designed for fast time to market.
  • Customizable for further product differentiation, via tight integration with Ceva’s sensing and inference IPs, including Ceva-NeuPro-Nano NPU, and Ceva-RealSpace Spatial Audio.

Block Diagram

Ceva-Waves Links200 block diagram

Specifications

Identity

Part Number
Ceva-Waves Links200
Vendor
Ceva, Inc.
Type
Silicon IP

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

Ceva, Inc.
HQ: USA

Learn more about Bluetooth IP core

The FCC Is Modernizing UWB Rules. Why It Matters for the Next Wave of Innovation

Ceva’s next-generation Ceva-Waves UWB architecture supports the new standard, delivering advanced ranging performance in challenging Non-Line-of-Sight (NLoS) environments and at extended range, while maintaining low-power operation and resilience to interference. It also supports UWB radar sensing and new channels introduced with the latest generation of the standard.

Frequently asked questions about Bluetooth IP cores

What is Multi-protocol wireless platform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)?

Multi-protocol wireless platform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter) is a Bluetooth IP core from Ceva, Inc. listed on Semi IP Hub.

How should engineers evaluate this Bluetooth?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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