TSMC signs up Apple for three-year FinFET deal
Peter Clarke, EETimes
6/24/2013 6:48 AM EDT
LONDON – Taiwan Semiconductor Manufacturing Co. Ltd. is set to supply Apple with processors using its FinFET process at the 16- and 10-nm nodes, after beginning with 20-nm planar CMOS, according to a report from Digitimes that referenced unnamed sources.
TSMC's IC design service partner Global UniChip, which works with customers to help prepare chips for the foundry, is also involved in the three-year deal, Digitimes report said.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Intel to Cut A Deal with Apple for Fab 42?
- Qualcomm Booking $4.5B in Apple Deal
- Apple announces multibillion-dollar deal with Broadcom for components made in the USA
- TSMC’s $100 Billion Investment in U.S. Shores Up Top Foundry
Latest News
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs
- Silicon Creations Celebrates 20 Years of Global Growth and Leadership in 2nm IP Solutions
- TSMC Debuts A13 Technology at 2026 North America Technology Symposium