TSMC’s $100 Billion Investment in U.S. Shores Up Top Foundry
By Alan Patterson, EETimes - March 5, 2025
TSMC will add $100 billion to its investment in the U.S. to start domestic production of AI chips, narrowly dodging tariffs of up to 50% that U.S. President Donald Trump was threatening to levy on imports from the Taiwanese company.
The expansion would build three new chip fabs, two advanced-packaging facilities and an R&D center near Phoenix, Arizona, making the project the largest single foreign direct investment in U.S. history, TSMC said. The company did not provide a timeframe or process technology roadmap for the new investment.
To read the full article, click here
Related Semiconductor IP
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- HBM3 PHY V2 (Hard) - TSMC N3P
- USB4 Gen3 x2-lane PHY, TSMC N5, 1.2V, N/S orientation, type-C
Related News
- U.S. to Hold Over 20% of Advanced Semiconductor Capacity by 2030, TSMC Expands Investment to US$165 Billion, Says TrendForce
- TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI
- Biden-Harris Administration Announces Preliminary Terms with Intel to Support Investment in U.S. Semiconductor Technology Leadership and Create Tens of Thousands of Jobs
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
Latest News
- Jim Keller: ‘Whatever Nvidia Does, We’ll Do The Opposite’
- FlexGen Streamlines NoC Design as AI Demands Grow
- IntoPIX Presents Its New Titanium Software Suite: Empowering AV-Over-IP Workflows With Speed, Quality & Interoperability
- Global Semiconductor Sales Increase 2.5% Month-to-Month in April
- Speedata Raises $44M to Launch First-Ever Chip Designed Specifically for Accelerating Big Data Analytics - Compute's Second Largest Workload