TSMC in talks to build fab in Dresden
By David Manners, ElectronicsWeekly (December 23, 2022)
TSMC is talking to suppliers about the possibility of putting a fab in Dresden, reports the Nikkei.
The talks are said to be about whether the suppliers would make the investments to support the fab.
To read the full article, click here
Related Semiconductor IP
- ISO/IEC 7816 Verification IP
- 50MHz to 800MHz Integer-N RC Phase-Locked Loop on SMIC 55nm LL
- Simulation VIP for AMBA CHI-C2C
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
Related News
- ESMC Breaks Ground on Dresden Fab
- Bosch opens wafer fab of the future in Dresden
- Infineon plans €5bn 300mm fab in Dresden
- After TSMC fab in Japan, advanced packaging facility is next
Latest News
- Quintauris and Andes Technology Partner to Scale RISC-V Ecosystem
- Europe Achieves a Key Milestone with the Europe’s First Out-of-Order RISC-V Processor chip, with the eProcessor Project
- Intel Unveils Panther Lake Architecture: First AI PC Platform Built on 18A
- TSMC September 2025 Revenue Report
- Andes Technology Hosts First-Ever RISC-V CON in Munich, Powering Next-Gen AI and Automotive Solutions