Infineon plans €5bn 300mm fab in Dresden
By David Manners, Electronics Weekly (November 16, 2022)
Infineon is planning a €5 billion fab in Dresden if it can get government subsidies.
Building the fab is dependent on state support for the Dresden factory, said CEO Jochen Hanebeck (pictured), adding that he has received a political signal.
He has said he would like to have more capacity for products made on processes with geometries ranging fron 28nm to 12nm to reduce reliance on Taiwan foundries.
The German economy ministry says it will “quickly examine the funding possibilities for the project announced by Infineon in terms of state aid and subsidy law’.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- GLOBALFOUNDRIES to Expand Presence in China with 300mm Fab in Chongqing
- 300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023, SEMI Reports
- 300mm Fab Spending to Boom Through 2023 With Two Record Highs, SEMI Reports
- Bosch opens wafer fab of the future in Dresden
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack