Infineon plans €5bn 300mm fab in Dresden
By David Manners, Electronics Weekly (November 16, 2022)
Infineon is planning a €5 billion fab in Dresden if it can get government subsidies.
Building the fab is dependent on state support for the Dresden factory, said CEO Jochen Hanebeck (pictured), adding that he has received a political signal.
He has said he would like to have more capacity for products made on processes with geometries ranging fron 28nm to 12nm to reduce reliance on Taiwan foundries.
The German economy ministry says it will “quickly examine the funding possibilities for the project announced by Infineon in terms of state aid and subsidy law’.
To read the full article, click here
Related Semiconductor IP
- Xtal Oscillator on TSMC CLN7FF
- Wide Range Programmable Integer PLL on UMC L65LL
- Wide Range Programmable Integer PLL on UMC L130EHS
- Wide Range Programmable Integer PLL on TSMC CLN90G-GT-LP
- Wide Range Programmable Integer PLL on TSMC CLN80GC
Related News
- GLOBALFOUNDRIES to Expand Presence in China with 300mm Fab in Chongqing
- 300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023, SEMI Reports
- 300mm Fab Spending to Boom Through 2023 With Two Record Highs, SEMI Reports
- Bosch opens wafer fab of the future in Dresden
Latest News
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- The world’s first open source security chip hits production with Google
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing