Infineon plans €5bn 300mm fab in Dresden
By David Manners, Electronics Weekly (November 16, 2022)
Infineon is planning a €5 billion fab in Dresden if it can get government subsidies.
Building the fab is dependent on state support for the Dresden factory, said CEO Jochen Hanebeck (pictured), adding that he has received a political signal.
He has said he would like to have more capacity for products made on processes with geometries ranging fron 28nm to 12nm to reduce reliance on Taiwan foundries.
The German economy ministry says it will “quickly examine the funding possibilities for the project announced by Infineon in terms of state aid and subsidy law’.
To read the full article, click here
Related Semiconductor IP
- eUSB2V2.0 Controller + PHY IP
- I/O Library with LVDS in SkyWater 90nm
- 50G PON LDPC Encoder/Decoder
- UALink Controller
- RISC-V Debug & Trace IP
Related News
- 300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023, SEMI Reports
- 300mm Fab Spending to Boom Through 2023 With Two Record Highs, SEMI Reports
- Bosch opens wafer fab of the future in Dresden
- Global 300mm Semiconductor Fab Capacity Projected To Reach New High in 2025, SEMI Reports
Latest News
- FuriosaAI ships RNGD, data-center-ready AI inference GPU alternative
- AMD, Adeas, Nextera Video, and intoPIX Announce Cost-Optimized IPMX Solution for AV-over-IP at ISE 2026
- Access Advance Extends HEVC Advance Rate Increase Deadline
- Lightmatter and Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure
- Lightmatter Collaborates with Synopsys to Integrate Advanced Interface IP with Its Passage Co-Packaged Optics Platform