TSMC to Start 10nm in 2017, Closing Gap with Intel
Alan Patterson
EETimes (2/24/2015 09:52 AM EST)
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest chip foundry, said that it expects to start 10 nanometer production in 2017, when it will have process technology matching that of industry leader Intel Corp.
“The performance of our 10nm, in terms of speed, power and density will be equal to what we believe Intel will define as its 10nm technology,” TSMC Director of Corporate Communications Elizabeth Sun told EE Times. “Technology-wise, we think we can close the gap at 10nm.”
For the first time this year, TSMC is expected to have the largest capex in the semiconductor industry as it aims to maintain its lead in the foundry business against rivals such as Samsung, Intel and Global Foundries.
TSMC has raised its capital expenditure budget for 2015 to US$11.5-12.0 billion, an increase of 11.5-20.0 percent compared with 2014, mainly due to its confidence in demand for advanced geometries. Intel spent $10.1 billion on capex during 2014. For the current year, Intel expects that figure to hold steady, at $10 billion, plus or minus $500 million.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Intel, TSMC to detail 2nm processes at IEDM
- Sofics Tapes Out Test Chip on TSMC 4nm Process with Novel ESD IP and Low-Power 1.8V and 3.3V GPIO Solutions
- Intel Eyeing AI Catchup in Inference with SambaNova Acquisition
- TSMC 3-nm Upgrade in Japan to Catch up With Demand
Latest News
- Arasan acheives the Industry's First ASIL-D Certification for its CAN XL IP Core
- Quintauris and Elektrobit Partner to Enable Reliable RISC-V Solutions for Automotive
- Wind River Joins the CHERI Alliance and Collaborates with Innovate UK to Accelerate Cybersecurity Innovation
- Arteris and MIPS Partner to Accelerate Development for Physical AI Platforms
- DCD-SEMI expands CryptOne with EdDSA Curve25519 IP core for secure embedded systems