Samsung fab cobbling IP offerings for data-intensive SoCs
By Majeed Ahmad, EDN (June 15, 2023)
Samsung Foundry is on the offense, this time by cobbling IP partnerships to help design engineers build complex system-on-chips (SoCs) for multiple process generations. A broad portfolio of IPs on Samsung’s fab platforms is also expected to help accelerate silicon success in highly demanding SoC designs for artificial intelligence (AI), automotive, high-performance computing (HPC), networking, and storage applications.
These announcements are significant amid the flurry of collaboration activities on the part of Intel Foundry Services (IFS), which has also been in the news for its PowerVia breakthrough, the first backside power delivery mechanism for 2-nm chips, which Intel is expected to make available next year ahead of archrivals TSMC and Samsung Foundry. All the while, TSMC has been going as strong as ever, both on semiconductor manufacturing technology and IP ecosystem frontiers.
Related Semiconductor IP
- USB-C 3.1/DP TX PHY for Samsung 14LPP, North/South Poly Orientation
- USB-C 3.1/DP TX PHY for Samsung 11LPP, North/South Poly Orientation
- 32G PHY, Samsung 8LPU x1, North/South (vertical) poly orientation
- 32G PHY, Samsung 8LPP x4, North/South (vertical) poly orientation
- 32G PHY, Samsung 10LPP x4, North/South (vertical) poly orientation
Related News
- T2M-IP Unveils MIPI D-PHY v2.5 Tx and DSI Tx Controller v1.2: Silicon-Proven, Low-Power, Cost-Effective IP Core Solutions for Advanced SoCs
- DisplayPort Rx PHY and Controller IP Cores in multiple Leading Technology Nodes for Next-Generation Video SoCs
- Faraday Unveils HiSpeedKit™-HS Platform for High-speed Interface IP Verification in SoCs
- Synopsys Delivers Industry's First Compute Express Link (CXL) IP Solution for Breakthrough Performance in Data-Intensive SoCs
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers