Rambus Signs Patent License Agreement with Toshiba
Sunnyvale, California, United States - March 15, 2011 -- Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies, announced today it has renewed its patent license agreement with Toshiba Corporation. This five year agreement covers Toshiba’s products with DRAM memory controllers for SDR, DDR, DDR2, DDR3, and other DRAM devices. Rambus will receive royalty payments based on the shipment of these memory controllers.
“Toshiba is a recognized leader of the global semiconductor industry, committed to providing its customers with state-of-the-art solutions,” said Sharon Holt, senior vice president and general manager of the Semiconductor Business Group at Rambus. “We are very pleased to continue our long and valuable relationship with Toshiba, who soon after our founding became Rambus’ first licensee.”
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies. Founded in 1990, the Company specializes in the invention and design of architectures focused on enriching the end-user experience of electronic systems. Rambus’ patented innovations and breakthrough technologies help industry-leading companies bring superior products to market. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Headquartered in Sunnyvale, California, Rambus has regional offices in North Carolina, Ohio, India, Germany, Japan, Korea, and Taiwan. Additional information is available at www.rambus.com.
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- Rambus and Kioxia Renew Patent License Agreement
- Rambus and SK hynix Extend Comprehensive License Agreement
- Rambus and Socionext Renew Patent License Agreement
- Conversant Announces Semiconductor Memory Patent License Agreement With Toshiba
Latest News
- Crypto Quantique and Attopsemi Unite PUF and I-fuse® OTP technology to Deliver Zero-Overhead Device Enrollment on FinFET Technology
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem