Nvidia calls for move to 450mm wafers
Rick Merritt, EETimes
4/12/2012 4:17 PM EDT
A diverse host of new technologies and methods will be needed to keep the industry on track to profitably deliver a trillion-transistor device by the end of the decade, said Sameer Halepete, vice president of VLSI engineering at Nvidia.
To read the full article, click here
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- Intel: 450-mm wafers must wait on 10-nm
- Could 450-mm wafers play away from the leading edge?
- Dresden fab could host 20-nm process, 450-mm wafers
- Companies Maximize 300mm, 200mm Wafers; Slow Progress on 450mm
Latest News
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs