Numem exhibits at the Flash Memory Summit
Sunnyvale, Calif, August 2, 2018 – Numem (formerly known as NVMEngines, Inc.), will be exhibiting at the Flash Memory Summit, on August 7-9, 2018 at the Santa Clara Convention Center in Santa Clara.
Numem has developed high performance and low power Memory IP cores based on MRAM and Design Automation Tools for integration into SoCs. These Memory IP Cores boast state-of-theart performance and can replace both SRAM and eFlash in applications such as low power IoT in, AI, Robotics and Automotive. MRAM based IP cores are expected to evolve with the process technology and bring strong power/performance/cost benefits, promising to replace embedded flash and SRAMs in many SoCs over time.
Numem will be exhibiting from 9:00 am to 5:00pm, demonstrating the results from its one of its MRAM memory IP test chip.
WHERE:
Santa Clara Convention Center, Santa Clara
5001 Great America Parkway, Santa Clara, USA
https://flashmemorysummit.com/
About Numem
Numem (formerly NVMEngines) is a leading provider of advanced memory products based on MRAM/ReRAM. Numem leverages its 50+ years experience in MRAM/ReRAM memory design and Design Automation Tools and test results from its multiple test chips. Numem’s patented technology provides best in class power, area, performance and product robustness to the memory industry, enabling secure, low-power and high-density storage with complete solutions from Silicon to Software. Visit our website http://www.numem.com or contact us at sales@numem.com.
Related Semiconductor IP
- Very Low Latency BCH Codec
- 5G-NTN Modem IP for Satellite User Terminals
- 400G UDP/IP Hardware Protocol Stack
- AXI-S Protocol Layer for UCIe
- HBM4E Controller IP
Related News
- IP-Maker to exhibit at Flash Memory Summit 2013, Booth #218
- Xilinx Showcases Smarter Solutions for Data Center Flash Storage and Application Acceleration at Flash Memory Summit 2014
- IP-Maker to showcase new NVMe reference design at Flash Memory Summit
- Altera to Demonstrate FPGA Technologies at Flash Memory Summit 2014
Latest News
- EnSilica: New Contract Wins and Programme Upgrades
- Ceva Launches Next-Generation UWB IP with Extended Range and Higher Throughput
- Axelera® AI Adds Kudelski Labs’ Security IP to Europa® Chip to Enable Secure, High-Performance Edge AI
- Synopsys Launches Electronics Digital Twin Platform to Accelerate Physical AI System Development
- Hexagon Semi’s HX77 AR Display Processor Achieves Ultra-Low Power Consumption with VeriSilicon’s Nano IP Portfolio