eASIC Announces 12.5Gbps JESD204B Interoperability Testing With Texas Instruments

Interoperability enables eASIC OEMs to quickly adapt their radio platforms without compromising bandwidth, power consumption or cost

Santa Clara, CA – December 15, 2014 – eASIC Corporation, a fabless semiconductor company delivering a custom IC platform (eASIC Platform), today announced that it has successfully completed JESD204B interoperability at 12.5 Gbps between its eASIC Nextreme-3 28nm Platform and the dual-channel, 16-bit, 2.5 GSPS DAC38J82 digital-to-analog converter (DAC) from Texas Instruments (TI). JESD204B is the next-generation high-speed serial interface standard that enables high throughput using low pin count for delay-aware and power-efficient radio applications.

The high bandwidth demanded by broadband and multi-channel LTE-Advanced radio equipment is challenging the interconnect between the digital signal processing device, DAC and analog-to-digital converter (ADC), and often requires trade-offs between bandwidth and power. The serial nature of the JESD204B interface enables less complex printed circuit board design and more flexible operations when dealing with evolving radio platforms. The eASIC Nextreme-3 devices and TI’s DAC38J82 are now interoperable using JESD204B at 12.5Gbps.

“The eASIC Nextreme-3 28nm Platform enables a high-bandwidth, low-power, JESD204B-compliant data converter interface that allows OEMs to efficiently address the requirements of demanding applications, such as remote radio heads and microwave fronthaul, as well as microwave backhaul radios,” said Christian Lanzani, Director for Wireless at eASIC Corporation. “The interoperability testing we’ve performed with TI’s DAC38J82 will enable our customers to quickly adapt their radio platforms without compromising on bandwidth, power consumption or cost.”

To obtain the interoperability report click here.

Click to tweet: @eASIC offers @TXInstruments JESD204B interoperability report.

About eASIC

eASIC is a fabless semiconductor company offering a custom IC platform (eASIC Platform) that incorporates a versatile base array, customizable single-mask layer and proprietary design tools. The breakthrough eASIC Platform provides the optimal combination of fast time-to-market, high performance, low power consumption, low development cost and low unit cost. The innovative eASIC Platform is enabled through a patented technology utilizing a single via mask layer for customization and avoids the painful tradeoffs associated with ASICs, ASSPs and FPGAs.

Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC please visit www.easic.com