DongbuAnam Extends ShuttleChip Program to Verify 130nm Prototype Chip Designs Using Copper Interconnects
SEOUL, Korea -- May 2, 2005 - DongbuAnam Semiconductor today announced that its ShuttleChip™ Program can now verify 130nm prototype chip designs with up to eight layers of copper interconnect. Expected to appeal to fabless companies worldwide, the 130nm/copper process addition to DongbuAnam’s ShuttleChip™ Program will be offered three times this year, beginning on June, 2005.
“Thanks to our ShuttleChip Program, our customers can drive down manufacturing costs by sharing a single mask set to verify prototype designs in silicon before committing to volume production,” said Jae Song, EVP of Strategic Business Development for DongbuAnam. “Our early ShuttleChip engagement with customers also enables us to accommodate special requirements rapidly and reduce time to high volume production.”
According to Song, DongbuAnam’s 130nm/copper ShuttleChip process is identical to the high-volume production process being used to produce system-on-chip solutions for advanced wireless and consumer electronics applications. “This superb process features a triple-well option plus a poly transistor gate length as small as 110nm to support standard-logic, high-performance, and low-power chip designs,” he added. He noted that the 130nm/copper ShuttleChip process can also be used to validate digital/analog intellectual property, cell libraries, I/O functions and other circuit elements.
About DongbuAnam Semiconductor
DongbuAnam Semiconductor, one of the largest pure-play wafer foundries in the world, specializes in world-class CMOS wafer processing that enables system-on-a-chip implementations that integrate the most advanced logic, analog, and mixed-signal technologies. Through close working relationships with strategic partners, DongbuAnam offers a broad range of services that augment its world-class wafer manufacturing capabilities. DongbuAnam is a key global supplier within Korea"s well-established semiconductor manufacturing infrastructure. The company’s stock trades on the Korea Stock Exchange under the stock code 001830. For more information, visit www.dsemi.com.
“Thanks to our ShuttleChip Program, our customers can drive down manufacturing costs by sharing a single mask set to verify prototype designs in silicon before committing to volume production,” said Jae Song, EVP of Strategic Business Development for DongbuAnam. “Our early ShuttleChip engagement with customers also enables us to accommodate special requirements rapidly and reduce time to high volume production.”
According to Song, DongbuAnam’s 130nm/copper ShuttleChip process is identical to the high-volume production process being used to produce system-on-chip solutions for advanced wireless and consumer electronics applications. “This superb process features a triple-well option plus a poly transistor gate length as small as 110nm to support standard-logic, high-performance, and low-power chip designs,” he added. He noted that the 130nm/copper ShuttleChip process can also be used to validate digital/analog intellectual property, cell libraries, I/O functions and other circuit elements.
About DongbuAnam Semiconductor
DongbuAnam Semiconductor, one of the largest pure-play wafer foundries in the world, specializes in world-class CMOS wafer processing that enables system-on-a-chip implementations that integrate the most advanced logic, analog, and mixed-signal technologies. Through close working relationships with strategic partners, DongbuAnam offers a broad range of services that augment its world-class wafer manufacturing capabilities. DongbuAnam is a key global supplier within Korea"s well-established semiconductor manufacturing infrastructure. The company’s stock trades on the Korea Stock Exchange under the stock code 001830. For more information, visit www.dsemi.com.
Related Semiconductor IP
- 8MHz / 40MHz Pierce Oscillator - X-FAB XT018-0.18µm
- UCIe RX Interface
- Very Low Latency BCH Codec
- 5G-NTN Modem IP for Satellite User Terminals
- 400G UDP/IP Hardware Protocol Stack
Related News
- Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs
- Minima qualifies to join Arm Flexible Access Program to bring the Minima Chip to Life
- Arteris Selected by Nextchip to Accelerate Chip Designs for Automotive Vision Technology
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Latest News
- Alchip Reports ASIC-Leading 2nm Developments
- AI Demand Drives 4Q25 Global Top 10 Foundries Revenue Up 2.6% QoQ; Samsung Gains Share and Tower Moves Up in Rankings
- GlobalFoundries Announces Availability of AutoPro150 eMRAM Technology on Enhanced FDX Platform for Advanced Automotive Applications
- Axiomise Launches nocProve for NoC Verification
- CAST Debuts TSN-EP-10G IP for High-Performance, Time-Sensitive Networking Ethernet Designs