Cadence Unveils Broad IP Portfolio for New TSMC 16nm FinFET Plus Process
SAN JOSE, Calif. -- 26 Sep 2014 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced a broad portfolio of intellectual property (IP) for TSMC’s 16nm FinFET Plus (16FF+) process. The wide array of IP for the 16FF+ process enables systems and semiconductor companies to take advantage of the 15 percent speed improvement with same total power or 30 percent total power reduction at the same speed compared to the16FF process.
Currently under development for the 16 FF+ process, the Cadence IP portfolio includes multiple high-speed protocols for several key memory, storage and interconnect standards critical in the development of advanced SoC designs. Silicon-tested IP is expected to be available beginning in Q4 2014. For detailed protocol information and availability details, customers should contact their local Cadence salesperson.
Cadence also announced today the qualification of its digital implementation, signoff and custom/analog design tools for the 16nm FinFET Plus process. Click here for more information.
“Our new 16nm FinFET Plus process is an important development for next-generation SoC designs as they balance the task of increasing performance while reducing power and area,” said Suk Lee, senior director of the Design Infrastructure Marketing Division at TSMC. “As a long time trusted TSMC partner, we believe Cadence will play a vital role in the broad adoption of this new process with its certified tools and IP portfolio.”
“Our broad portfolio of IP for 16 FinFET Plus will enable design teams to ramp quickly on next-generation SoC designs and immediately realize the performance and power benefits of this new FinFET process,” stated Martin Lund, senior vice president and general manager of the IP Group at Cadence.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
Related Semiconductor IP
- HBM4 PHY IP
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Cadence Announces DDR4 and LPDDR4 IP Achieve 3200 Mbps on TSMC 16nm FinFET Plus Process
- Silicon Creations Announces 1000th Production FinFET Tapeout at TSMC and Immediate Availability of Full IP Library on TSMC N2 Technology
- Cadence Partners with TSMC to Power Next-Generation Innovations Using AI Flows and IP for TSMC Advanced Nodes and 3DFabric
- Cadence Tapes Out UCIe IP Solution at 64G Speeds on TSMC N3P Technology
Latest News
- LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions
- Global Semiconductor Sales Increase 29.8% Year-to-Year in November
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract