ARM wrestles with silicon, battery hurdles
Rick Merritt, EETimes
8/19/2011 12:10 AM EDT
"Silicon scaling will end at some point, and I think it's coming sooner than many people think," said Simon Segars, general manager of ARM's physical IP division in a keynote at the annual Hot Chips event here. What's more, "we really need a new battery technology," he said.
With silicon atoms measuring a fraction of a nanometer in diameter and process technology approaching single nm digits, "you can only scale so far before we need other materials like III-V semiconductors," he said
To read the full article, click here
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
- Chevin are proud to be awarded runner-up of Arm Silicon Startups Contest 2025
- Credo Joins Arm Total Design to Accelerate the Development of Custom Silicon for AI Data Centers
- Arm Accelerates the Edge AI Revolution with Easy, Low-Cost Access to Armv9 Platforms through Arm Flexible Access
Latest News
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs