Sonics and Tensilica Team to Increase IP Integration, SoC Efficiencies 2012-02-02 13:18:00 IP Cores & Design
Express Logic Brings High Performance to Cortex-M4 with ThreadX RTOS and NetX Duo TCP/IP Stack 2012-02-02 10:24:00 SoC Architecture & Assembly
Triad Semi Introduces Three New Via Configurable ASIC Arrays 2012-02-02 09:18:00 SoC Architecture & Assembly
Qualcomm Chipset Powers First Successful VoIP-Over-LTE Call With Single Radio Voice Call Continuity 2012-02-02 03:11:00 SoC Architecture & Assembly
CEVA Announces Availability of Silicon-Based CEVA-XC Software Development Kit for the Rapid Design of Multi-Mode, Software-Defined Modems 2012-02-01 13:05:00 IP Cores & Design
New Integration Between SpaceStudio Hardware Software Co-design and European Space Agency’s TASTE Tool Set 2012-02-01 09:38:00 EDA & Design Tools
LTE Expected to Dominate Wireless Infrastructure Spending by 2013 2012-01-31 14:36:00 Analysis & Insight
CEVA, Inc. Announces Record Fourth Quarter and Year End 2011 Financial Results 2012-01-31 14:26:00 SoC Architecture & Assembly
Xilinx Launches First Design Platforms for Accelerating 7 Series FPGA Design Productivity and System Integration 2012-01-31 14:19:00 SoC Architecture & Assembly
ARM Holdings PLC Reports Results for the Fourth Quarter and Full Year 2011 2012-01-31 08:48:00 Financials
Digital Blocks Expands Video Signal & Image Processing IP Core Family 2012-01-31 08:34:00 IP Cores & Design