Tensilica to Demonstrate Fujitsu Smartphone that Uses Multiple Tensilica DPUs Including ConnX BBE DSP and HiFi Audio/Voice at Mobile World Congress in Barcelona

SANTA CLARA, Calif.  USA – February 20, 2013 –  Tensilica, Inc. today announced that it will be demonstrating NTT DOCOMO’s ARROWS X F-02E smartphone at its booth #6D101 at the Mobile World Congress show in Barcelona, Spain, February 25-28, 2013. NTT DOCOMO’s ARROWS X F-02E is the first smartphone to employ the ANT30 multi-mode modem from Access Network Technology Limited (ANT). ANT is jointly owned by Fujitsu Limited, NTT DOCOMO, INC., NEC Corporation and Fujitsu Semiconductor Limited. The ANT30 multi-mode modem employs multiple Tensilica dataplane processors (DPUs) and ConnX BBE-based digital signal processors (DSP) to do the complex signal processing for multimode 4G LTE and 3G communications.  It also uses Tensilica’s HiFi Audio/Voice DSP (digital signal processor) for high-quality sound.

“The ANT30 represents the second generation of integrated 4G LTE and 2G/3G chips that have used Tensilica’s DPUs and DSPs – the first generation has been very successful in the Japanese market,” stated Eric Dewannain, Tensilica’s vice president and general manager of the baseband business unit. “In this second generation, ANT has significantly reduced the power dissipation to increase battery life by employing specifically optimized Tensilica DPU programmable accelerators, in addition to the versatile ConnX BBE DSP. The ANT modem, designed to service the worldwide market due to its software programmability, can quickly adjust to standard evolution or new requirements.”

The ANT30 is being designed into next-generation smartphones and tablets. It provides support for 2G/3G and 4G LTE modems with a peak data rate of 100 Mbps for high-speed data communication. Its unique software-programmable radio (SPR) technology employs a Tensilica-based multi-core architecture. For more details, visit http://a-n-t-jp.com/en/products/cosmos/.

Tensilica’s HiFi Audio/Voice DSP family is the most widely-used licensable audio/voice DSP family, with support for over 100 proven audio/voice software packages. Over 50 companies have licensed Tensilica’s HiFi DSP family, and they’ve shipped over 200 million HiFi DSP cores in their smartphones, tablets, computers, digital televisions, home entertainment systems and other devices.

About Tensilica

Tensilica, Inc. is the leader in dataplane processor IP cores with over 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica’s automated design tools to meet specific and demanding signal processing performance targets. Tensilica’s DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.