Altera and China Mobile Research Institute Announce Joint Efforts on Next Generation C-RAN Wireless Technologies 2014-09-10 14:13:00 SoC Architecture & Assembly
Tabula and Intel Work Together to Enable Next-Generation Data Center 2014-09-10 13:47:00 SoC Architecture & Assembly
SMIC Introduces Independently Developed 38nm NAND Process Technology 2014-09-10 11:07:00 Foundries & Process Nodes
USB 3.0 Promoter Group Announces Power and Device Class Specifications to Support Development of USB Type-C Ecosystem 2014-09-09 17:42:00 Misc
ASMedia Technologies Demonstrates Industry's First SuperSpeed USB 10 Gbps (USB 3.1) Silicon ASM1352R (USB3.1 to SATA6G with RAID) at Intel Developer Forum 2014-09-09 17:35:00 SoC Architecture & Assembly
Kilopass Recruits Bruce Bateman for Development of the Next-Generation Memory 2014-09-09 15:34:00 People & Leadership
Allegro DVT showcases its HEVC/H.265 Video Encoder IP at IBC 2014. 2014-09-09 14:33:00 IP Cores & Design
Credo Announces First 56G SerDes Technology Based on Conventional NRZ Modulation 2014-09-09 08:30:00 IP Cores & Design
Lattice's New USB 3.1 Type-C Power Delivery Solution Speeds Development of Next-Generation USB Connectors 2014-09-09 08:20:00 SoC Architecture & Assembly
QuickLogic and GLOBALFOUNDRIES Collaborate to Deliver Next-Generation Sensor Hub for Smartphones and Wearables 2014-09-09 08:12:00 Foundries & Process Nodes
Genesys Logic announced a reference design pairing its USB 3.0 card reader controller GL3221 with NFC transceiver ST95HF from STMicroelectronics 2014-09-09 08:03:00 SoC Architecture & Assembly
Altera Demonstrating FPGA-based Data Center Solutions at Intel Developers Forum 2014 2014-09-09 07:58:00 Misc
Credo Semiconductor Appoints Jeff Twombly as Vice President of Sales and Business Development 2014-09-09 06:37:00 People & Leadership