HP Extends Benefits of ARM Architecture Into the Datacenter With New Servers 2014-09-29 16:21:00 SoC Architecture & Assembly
ARM and Cadence Expand Collaboration for IoT and Wearable Device Applications Targeting TSMC's Ultra-Low Power Technology Platform 2014-09-29 16:03:00 EDA & Design Tools
ARM and Synopsys Expand Collaboration to Improve Quality of Results and Time-to-Results for Leading-Edge ARMv8-A and ARMv7-A Cores 2014-09-29 15:09:00 EDA & Design Tools
Cadence IP Portfolio and Tools to Support New TSMC Ultra-Low Power Technology Platform 2014-09-29 13:49:00 IP Cores & Design
TSMC launches ultra-low power technology platform for IoT and wearable device applications 2014-09-29 13:16:00 Foundries & Process Nodes
Lenovo Set to Close Acquisition of IBM's x86 Server Business 2014-09-29 10:42:00 Strategic Partnerships
Smartphone Connectivity Presents Both Opportunities and Challenges for Automotive Processor Chip Suppliers 2014-09-29 09:36:00 Analysis & Insight
Cadence Unveils Broad IP Portfolio for New TSMC 16nm FinFET Plus Process 2014-09-29 07:40:00 IP Cores & Design
Cadence Digital and Custom/Analog Tools Achieve TSMC Certification for 16FF+ Process, Companies Collaborate on 10nm FinFET 2014-09-29 02:42:00 EDA & Design Tools
Allegro DVT demonstrates its HEVC/H.265 Video Encoder IP and Compliance Streams at ARM TechCon 2014 2014-09-26 14:40:00 Misc
Leading-Edge IC Foundry Market Forecast to Increase 72% in 2014 2014-09-26 08:24:00 Analysis & Insight
Intel and Tsinghua Unigroup Collaborate to Accelerate Development and Adoption of Intel-based Mobile Devices 2014-09-26 08:08:00 Strategic Partnerships
Cadence to Demonstrate 16FF+ Design Solutions at TSMC 2014 OIP Ecosystem Forum 2014-09-26 07:23:00 Misc
Synopsys Tools Achieve TSMC Certification for 16-nm FinFET+ Process and Entered 10-nm FinFET Collaboration 2014-09-25 15:07:00 EDA & Design Tools
TSMC delivers first fully functional 16FinFET networking processor 2014-09-25 11:47:00 Foundries & Process Nodes