Chips&Media to Demonstrate Latest IP at Mobile World Congress 2010 2010-02-01 06:54:00 IP Cores & Design
NetLogic Microsystems Enables Significantly Richer LTE and IPTV Network Services with the World's First Knowledge-based Processor with High-Speed Serial Interface 2010-02-01 06:16:00 SoC Architecture & Assembly
Samsung Develops Most Advanced Green DDR3 DRAM, Using 30nm-class Technology 2010-02-01 03:32:00 SoC Architecture & Assembly
Virage Logic's 45nm and 28nm SiWare Memory Compilers Automatically Support Calypto's PowerPro MG tool 2010-02-01 02:57:00 EDA & Design Tools
Cypress and Keil Team Up to Deliver High-Performance Compiler Options for Cypress's New PSoC 3 and PSoC 5 Architectures 2010-02-01 01:06:00 SoC Architecture & Assembly
Dolphin Integration announces the availability of a complete FREE evaluation kit for its Memory CACHE controller 2010-01-29 17:43:00 IP Cores & Design
Agnisys announces support for OVM Register Package in IDesignSpec 2010-01-29 08:10:00 EDA & Design Tools
MIPS Technologies Reports Second Quarter Fiscal 2010 Financial Results 2010-01-29 07:15:00 Financials
Synopsys Showcases Silicon-Proven DesignWare IP Solutions for SuperSpeed USB 3.0, DDR and PCI Express at DesignCon 2010 2010-01-28 17:20:00 Misc
CEVA, Inc. Announces Fourth Quarter and Year End 2009 Financial Results 2010-01-28 15:40:00 Financials
Arasan Chip Systems hosts panel discussion on Total IP Solutions at DesignCon 2010 2010-01-28 09:31:00 Misc
OCP-IP Delivers Even More OSCI TLM 2.0 Compatibility in Advanced SystemC TLM Kit 2010-01-27 17:18:00 EDA & Design Tools
ROHM Signs Major 1T-SRAM Technology License Agreement with MoSys 2010-01-27 14:57:00 Commercial Deals